Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
In this paper, a comprehensive modeling is carried out to investigate the dynamic behaviors of WL-CSP subjected to both flat and vertical drop impacts. The non-linear dynamic properties include solder, Cu pad and the metal stacking under the UBM. Both of the JEDEC standard flat drop test and the vertical drop test modeling for different solder bump height are studied. The results showed that, in the...
Two embedded micro-wafer-level packages (EMWLP) with 1) laterally placed and 2) vertically stacked thin dies are designed and developed. Three-dimensional stacking of thin dies is demonstrated as progressive miniaturization driver for multi-chip EMWLP. Both the developed packages have dimensions of 10 mm × 10 mm × 0.4 mm and solder ball pitch of 0.4 mm. As part of the development several key processes...
Although single die eWLB has been around for quite some time, processing of multi-die packages can pose many challenges. In multi-die eWLB package, two or more dies are placed side by side with a small gap, encapsulated by mold compound and interconnected with redistributed layers (RDL) and solder balls. The objective of this paper is to share the challenges in processing multi-die eWLB packages,...
Wafer level Chip Scale Package (WLCSP) fulfills the demand for small, light, and portable handheld electronic devices, and it is one of the most advanced packaging concepts. When the WLCSP was assembled on board level, the connection, i.e. solder joints are generally the critical and challenging issue for the whole device's reliability. In addition to the shape and material of solder joints, the material...
With the advance of high-performance and small-size microelectromechanical systems (MEMS) devices, wafer-level packaging has gained increased attention over the past few years. Most MEMS packages must protect the often-fragile mechanical structures against the environment and provide the interface for the interaction with the next level in the packaging hierarchy. It is obvious that stable performance...
The increasing demand for portable electronics has led to the shrinking in size of electronic components and solder joint dimensions. The industry also made a transition towards the adoption of lead-free solder alloys, commonly based around the Sn-Ag-Cu alloys. As knowledge of the processes and operational reliability of these lead-free solder joints (used especially in advanced packages) is limited,...
The system-in-package (SiP) is among the popular package structures which meet the trend of integrated circuit (IC) product development. The SiP structure investigated in this study includes seven sub-chips attached to the chip carrier, with polymer applied around the chips. The polymer is used as an exceptional stress buffer layer and it can reduce the stress/strain in the solder joints. However,...
The developed bonding process utilizes AuSn solder and provides liquid-proof sealing and multiple reliable electrical connections between the bonded wafers. The bond can withstand 300degC and features a thin bond line (2-3 mum), high bond strength, excellent bond gap control, and low stress due to small amount of bonding material. A Nb/Au seed layer was shown to be an optimal adhesion and barrier...
The demand for wafer level packages (WLP) has increased significantly due to its smaller package size and lower cost. However, board level reliability of WLP is still a major concern. This study investigates the board level temperature cycle reliability of three very different wafer level package configurations. Comprehensive studies are carried out through temperature cycle test, failure analysis,...
This paper will describe a new technique to increase the reliability of wafer-level packages (WLPs). The technique enables the placement of a protective coating around the solder balls using a maskless process and provides improved reliability performance as compared to unprotected devices. In addition, the unbonded devices allow for easier handling. This approach also minimizes form factor requirements...
For advanced wafer-level chip scale packages (WLCSP), board level solder joint reliability is a major concern, and typical stress-relieving methods such as capillary underfills and molding compounds are costly. One method of low cost reliability improvement for WLCSPs is the use of a wafer level SolderBracetrade coating, which delivers improved reliability with minimal material and capital cost. In...
According to expansion of the market for portable products such as mobile phone, digital camera and PMP, adoption of WLP for various devices was increasing. Recently, WLP was being applied to higher pin count device as well as lower pin count device. In case that WLP is applied to higher pin count device, various reliability issues are expected from large die size and fine solder ball pitch. The more...
Copper/Low-k structures are the desired choice for advanced integrated circuits (ICs) as the IC technology trends moving toward finer pitch, higher speed, increased integration and higher performance ICs. Copper interconnects with low-k dielectric material improves the ICs performance by reducing interconnect RC delay, cross talk between adjacent metal lines and power loss. However, low-k materials...
The technique of wafer level chip scale package (WLCSP) is similar as flip chip packages without using underfill. The weakest point is solder joint reliability issue so the package size of WLCSP in current industry is used less than 10times10 mm2. In this paper, we use 5.5times5.5 mm2 package size to take as test vehicle and focus on ball peeling and shear stresses to assume and simulate drop test...
Wafer Level Packaging (WLP) has the highest potential for future single chip packages because the WLP is intrinsically a chip size package. The package is completed directly on the wafer then singulated by dicing for the assembly. All packaging and testing operations of the dice are replaced by whole wafer fabrication and wafer level testing. Therefore, it becomes more cost-effective with decreasing...
To examine dispersion of the packaging reliability of WLP, we grouped Weibull distribution of the temperature cycle test lifetime every tendency. And we examined in detail the cross section of the solder which is the typical sample of each group. As a result, it became clear that the lifetime and solder resist opening diameter had correlation. Furthermore, it became clear that the destruction modes...
This paper aims to provide a fine-pitch Sn/0.7Cu lead-fee solder bumps fabrication process that is characterized by using a novel plating-friendly polishing mechanism to transform the plated-based Sn/0.7Cu lead-free solder bumps with huge height deviation into smooth and uniform ones. The final experimental results showed that the UIW (uniformity in wafer) of Sn/0.7Cu solder bumps at 50 mum pitch...
This paper evaluates two novel copper pin-head pillar interconnection structures with solder joints suitable for fine-pitch, low stand-off height interconnection for flip chip technology. Current flip chip interconnection requires underfill encapsulation to meet the requirements in thermal cycling fatigue test. An alternative to underfill encapsulation for improving solder joint reliability is to...
In this study a WLCSP structure in microelectronic application is considered. In the current development of WLCSP solder post is used to bridge the die and solder bump to release part of the stress concentration caused by mismatch of Thermal Expansion Coefficient (CTE). Thermal cycle reliability analysis on solder joints with 3D finite element simulation is firstly carried out. The stress/creep strain...
Wafer level packages (WLP) and Quad flat no-lead (QFN) packages are both widely used in electronics assemblies. This is because they both provide good electrical and thermal performance and especially low cost as they are simple in the construction. In this paper, two designs of experiment (DoEs) have been constructed. The first DoE is employed to characterize the impact of the module reliability...
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.