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This paper evaluates two novel copper pin-head pillar interconnection structures with solder joints suitable for fine-pitch, low stand-off height interconnection for flip chip technology. Current flip chip interconnection requires underfill encapsulation to meet the requirements in thermal cycling fatigue test. An alternative to underfill encapsulation for improving solder joint reliability is to...
In order to satisfy module miniaturization requirements for next-generation products, an advanced substrate integration platform is highly desirable. In recent years, intensive research has been carried out on integrating actives and passives within the common substrate platform, to achieve system integration within a module. Low temperature cofired ceramic (LTCC) technology is a substrate platform...
To our knowledge, this is the first report of asteroid hyalosis giving rise to spurious automated refraction readings. A patient with asteroid hyalosis had uneventful phacoemulsification with intraocular lens implantation. Using a Nikon autorefractor, the postoperative refraction was +13.0 diopters (D); retinoscopy revealed that it should be +1.0 D. Asteroid hyalosis changes the optical quality of...
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