The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The following topics are dealt with: advance electronic materials and processing, sensors, chipMOS, passive components and interconnection technology, modelling and simulation, advanced electronics packaging, and quality and reliability.
In this paper, the effects of the degree of cure of an Anisotropic Conductive Film (ACF) on the material properties and the contraction stress build-up of the ACF and ACF joints stability were investigated. The degrees of cure of the ACF as a function of bonding times were quantitatively obtained by a dynamic DSC study and an Attenuated Total Reflectance/Fourier transform infrared (ATR/FT-IR) analysis...
To estimate the fluorine thermal stability of fluorine doped zinc oxide (ZnO:F) films, ZnO:F films were prepared by co-sputtering zinc oxide(ZnO) and magnesium fluoride (MgF2) targets under different sputtering powers. The prepared films were tested with a thermal desorption system heated from room temperature to 500degC. Four elements: zinc (Zn), oxygen (O), magnesium (Mg) and fluorine (F) from ZnO:F...
Nowadays, the demand for the printed wiring board (PWB) of the environment harmony type is rising rapidly. We have developed a new halogen-free material with low coefficients of thermal expansion (CTE), which will be applied to the plastic packages such as FC-BGA and CSP. The original resin system and filler treatment technique named FICS (filler interphase control system) were applied to the material...
In addition to a reduced Ag content, it has been demonstrated that significant improvement of drop test performance of Sn-Ag-Cu solder joints can be achieved by alloying with Mn and Ti. This study aims to investigate the effects of Mn and Ti additives on the microstructure and solidification behavior of Sn-1.0Ag-0.5Cu alloys, as well as mechanical properties and thus to explain how the alloying elements...
This study investigated the thermal effect on the interfacial IMC (Cu3Sn and Cu6Sn5) formation at the interface between pure tin and a copper substrate at 125degC. During thermal aging, the morphology of Cu6Sn5 transformed from a scallop to a layer shape. The thickness of IMCs (Cu3Sn, Cu6Sn5) changed with an increase in aging time. It was observed that scallop Cu6Sn5 decomposed during heat aging for...
Fatigue strength of electroplated copper thin films was measured under uni-axial stress. Two kinds of electroplated films were prepared for the fatigue test. One was a commercial film mainly used for interconnections in printed wiring boards. The other film was grown on a stainless steel substrate by using acid copper sulfate bath without any additive agent. The micro texture of each film was observed...
This article discusses thermo-compression bonding (also known as diffusion bonding) of metallic copper and its application in 3-D stacking of ICs. Bonding process is described and characterization results are presented. A survey on recent progress of copper-based wafer bonding, particularly low temperature process, and its application for on wafer 3-D ICs are presented.
In this paper, we performed a 4 Ch times 2.5 Gbps flexible opto-electrical interconnect module integrated with two silicon optical benchs (SiOBs), four fibers and one rigid-flexible PCB, which provided with capability of optical and electrical data transmission simultaneously. The high-speed data transmission interconnects through fiber, and the electrical transmission interconnects through the circuit...
In this work, we studied the availability of p-type MOSFET with 1 mum channel width and 0.15 mum channel length as a stress sensor. Under mechanical, thermal, and thermo-mechanical coupling effects, parameters of the MOSFET devices were extracted based on a new measurement methodology, and linear relationships between drain current variation and stress and/or thermal effects were obtained. According...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.