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The transmission laser soldering technology described in this paper enables the realization of rigid - flexible interconnection after mass reflow soldering of the surface mount components to the rigid printed circuit board (PCB). The novelty of our approach is that the solder paste is heated up selectively by an Nd:YAG laser through the flexible substrate, which is in most cases polyimide (PI). The...
Liquid crystal on silicon (LCOS) microdisplay is typically less than frac12 inch in diameter and usually a field sequential illumination system is used for colour creation. In most high power microdisplay based projectors the colour sequences are produced with colour wheels and the microdisplay is a MEMS device, but in lower power projectors of near to eye displays (NED) the displays are LCD panels...
At present the successful diagnosis of fetal abnormalities relies on the analysis of fetal genetic material obtained through invasive procedures such as amniocentesis and chorionic villus sampling (CVS). These procedures are expensive, time consuming and have the potential to cause harm to both the fetus and mother. A review of current diagnostic techniques in the field of prenatal care is presented...
The paper presents a research project in communication systems for people with neuro-muscular disabilities. It deals with the design and implementation of an electronic system for the communication with people with major neuro-muscular disabilities. While considerable efforts have been made worldwide to find solutions for developing complex communication systems for people with severe disabilities,...
The main results concerning vacuum deposition of thin films to the silicon wafers and local electrochemical covering to the interconnecting frame have been described in the paper. These methods and technological conditions have been developed in order to meet the requirements of the process of VLSIs packaging into plastic housings.
An infrared (IR) temperature measurement system consists of not only a sensor module and electronics, but also an optomechanical system that guides IR radiation onto the sensor. The geometry and emissivity of the parts affects the reading, if the detector sees not only the target but parts of the measuring system itself. In normal industrial applications, the optics is designed so that the surfaces...
The development of innovative electronic devices is characterized by increasing demands with respect to functionality, further miniaturization, high reliability and simultaneously lower manufacturing costs. The study of Polymer Thick-film Technology (PTF) regarding improvements in print resolution and conductivity demonstrates its potential for an application in microelectronics. Polymeric thick-film...
Optical encoders are pervasive in almost all sectors of industry including metrology, motion systems, electronics, medical, scanning/ printing, scientific instruments, space applications and specialist machine tools. The precision of automated manufacture and assembly has been revolutionised by the adoption of optical diffractive measurement methods. Todaypsilas optical encoders comprise discrete...
A major disadvantage of supercapacitors in comparison with batteries is significantly lower specific energy. By assembling of six packaged supercapacitor cells of 3000 F and 2.5 V into a packaged module, a decrease of the maximum specific energy from 4.7 Wh/kg for an individual cell to 2.7 Wh/kg for the module takes place. Such values are related to high performance supercapacitor cells/modules available...
Assembly and encapsulation is in many cases a restriction for miniaturizing microsystems. For implantable devices with a signal cable attached this is even more critical. This paper introduces assembly methods for a micro ribbon cable, focusing on insulation removal and cable-substrate bonding. Two different methods for stripping the cable are presented; the use of femto second laser and by plasma...
The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on level of aggregation of filler particles. The research has been focused on improvement of electrical properties by better aggregation of filler particles in adhesive. Following methods...
The integration of CMOS electronics with MEMS (micro-electro-mechanical systems) is attractive because it allows MEMS components to be co-located with their associated control and signal processing circuits. However, monolithic integration of electronics with micromechanics generally involves a high initial investment, and can be difficult because of process and material incompatibilities. One approach...
Room-temperature bonding by means of mechanical caulking to electrically interconnect stacked chips using through-silicon vias can greatly reduce process cost. We have already demonstrated the feasibility of this approach in several test samples. However, in a three-dimensional system-in-package sample containing a commercially available microcomputer unit, we encountered some difficulties in manufacturing...
In this paper a low temperature dasiavia-lastrdquo technology will be presented. This technology has been especially developed for CMOS image sensors wafer level packaging. In the first part of this paper, the steps of the through silicon vias (TSV) technology will be presented: glass wafer carrier bonding onto the silicon substrate, silicon thinning and backside technology including specific steps...
Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first time indium interconnects established between dummy dies and substrates as integral part of a capillary SA process. We present a simple way to...
The move to higher frequencies has stimulated the development of the materials and integration techniques of the RF/microwave/millimeter (mm)-wave areas. Until now, materials commonly used at high frequency are either expensive or have inadequate performance. Liquid crystal polymers (LCPs), have attracted much more attention as advanced candidates as RF/microwave/mm-wave substrate materials for commercial...
System in package (SiP) plays an important role in the mobile communication market, while it can efficiently improve the size shrinkage, cost-effectiveness and available time of the products. Good achievements have been realized by other works in the past years, such as VCO, PA, BPF, Balun, Bluetooth module, and Wi-Fi systems with embedded passives [1-4]. Nowadays, the current trend is towards personal...
This paper describes an approach for realizing a triplexer, based on integrated optics technology. This device combines the silica on silicon technology with hybrid integration. The filtering function is realized inside PLC using high Deltan (Deltan = 2.5%) waveguides. The photo-detectors, the laser diode and the trans impedance amplifier are hybrid integrated inside the component. Finally, plastic...
Rheological properties of solder pastes are very important for a high quality surface mount technology process. The stencil/screen printing process of solder pastes is one of the most critical steps in the SMT assembly process, as most of the assembly defects can often be shown to originate from paste rheology and associated poor printing performance. This paper concerns an investigation of the effect...
A typical set up used to perform lifetime tests of packaged, fiber pigtailed semiconductor lasers is described, as well as tests performed on a set of four pump lasers. It was found that two lasers failed after 3200 and 6100 hours under device specified bias conditions at elevated temperatures. Failure analysis of the lasers indicates imperfections and carbon contamination of the laser metallization,...
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