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In this study, finite element analysis (FEA) was used to simulate a thermal cycling test result for a PBGA assembly with Sn-3.8Ag-0.7Cu solder joints subject to thermal cycling of -40°C to +125°C. The PBGA assembly was modeled using a 3D-quarter 1/8th octant model of the PBGA assembly. Two constitutive models for the SAC387 solder were investigated using the Anand Viscoplastic (AV) model and elastic-plastic-creep...
Lead-free solders have strain rate dependent mechanical properties. In this work we report the elastic modulus and yield strength of several lead-free solder alloys at different strain rates. They are SnAgCu (with Ag 1 to 4% and Cu at 0.5%, namely SAC105, SAC205, SAC305 and SAC405), SAC-X (X=In, Ni and Bi), SnCu, SnCu-X and SnAg alloys. The intermediate strain rate tests (10-3-101 1/sec) were conducted...
Solder joints are subjected to a complex combined loading condition of tensile and shear deformation. The fracture behavior of solder joints is different when it is subjected to pure-tensile, pure shear or varying combination of mixed-mode tension and shear loading combinations. The observed failure modes can vary from brittle intermetallic (IMC) layer failure to ductile bulk solder shear failure...
Lead free solders with Sn-Ag-Cu (SAC) alloy compositions are now widely used in the electronics industry. Further enhancement of SAC solders by small addition of a forth element is aimed to improve the solder mechanical properties and the solder joint properties at the intermetallic bond interfaces. The addition of Ce to SAC solder with an alloy composition of Sn.3wt%Ag0.5wt%Cu0.019wt%Ce (SACC) shows...
In this paper, solder alloy of Sn-3.8Ag-0.7Cu (SAC387) and Sn-1.0Ag-0.5Cu-Y (SAC105-Y), where Y is a small addition of a fourth element, were tested at room temperature to study the strain-rate-dependent elastic modulus and yield strength of the solder. Nano-indentation tests were conducted at various strain rates from 10-3 to 101 1/s by using the continuous stiffness measurement (CSM) technique....
This paper evaluates two novel copper pin-head pillar interconnection structures with solder joints suitable for fine-pitch, low stand-off height interconnection for flip chip technology. Current flip chip interconnection requires underfill encapsulation to meet the requirements in thermal cycling fatigue test. An alternative to underfill encapsulation for improving solder joint reliability is to...
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