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Cellular growth, especially its pattern formation, has been studied both experimentally and numerically. In situ observations of faceted cellular growth have clearly revealed cellular interactions in the array of cells. For the first time, the true time-dependent faceted cellular array growth has been modelled properly. It has been found that pattern formation is determined by cellular interactions...
Electromagnetic interference (EMI) has become a remarkable and negligible problem in SiP module. As package tend to higher density and smaller size, the electromagnetic environment become complex and severe. The shortening distance between different devices in SiP enhances the EMI between different devices. Shielding methods in SiP, especially in 3D package, are worth researching. In this paper, a...
Since high speed digital signal interconnection usually consists of differential transmission lines and pairs of via, signals passing through pairs of via need carefully handling for via can be either capacitive or inductive. The modeling of high speed via is critical to match the impedance of a pair of via and differential transmission line. Parasitic parameters of a pair of via such as capacitances...
Chip to Package Interaction (CPI) is becoming a critical reliability issue due to the adoption of new materials used for Si backend interconnects like extreme low k (ELK) dielectric, Pb free solder and Cu pillar bumping and the advanced packaging technologies such as high performance flip chip BGA and 2.5D/3D packages. CPI failures are primarily inside the Si die with the typical failure modes such...
Today a range of wireless communication products have the requirement of achieving a higher integration level. In this paper, we propose two RF SiPs based on a RF prototype board for micro base station. The two RF SiPs integrate a complete 700–2600MHz RF system that includes transmitter, receiver, and feedback module, ADC/DAC and clock module. RF SiP 1 consists of two multilayer organic substrates,...
A band-pass-filter (BPF) based on silicon substrate was designed and simulated. Different software was applied to design and simulate the character of the filter. A three-order filter was designed dedicating to range 2.4 GHz-2.5 GHz use. The ideal topology circuit was designed with passive inductors and capacitors. Moreover, the integrated passive devices (IPDs) were modeled and simulated with thin...
Electromagnetic isolation is a critical issue to the performance of radio frequency system in package (RF SIP). This paper proposes a novel structure to measure the electromagnetic (EM) isolation property and to test the shield efficiency of a metal cap. The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates. EM interference and EM isolation relevance...
Passive devices are widely used in all kinds of systems. Generally, most of the passive components in an electronic system are assembled as discrete components or passive arrays. Bu t a discrete passive component occupies a lot of space for the realization of its function. To overcome this shortcoming, one promising way is the integration of passive components into system in package. In this paper,...
Glass is an ideal material for 2.5D packaging application with excellent electrical, optical and mechanical properties. In this paper, several forms of coplanar waveguide (CPW) on glass substrate were modeled and simulated using 3D full-wave finite element method (FEM). The target of this research was to provide guidance for the design and analysis of CPW on glass substrate. Analyses of CPWs on different...
With the increasing need of smaller size and lower cost of wireless communication system, the integrated passive devices (IPDs) have offered a proper solution. However, small Q factor (quality factor) of integrated passive inductors seriously limits the performance of the IPDs. In this paper, a simplified circuit model of the inductor structure has been presented to extract the parasitic parameters...
This paper discusses the application of conductive wafer bonding, especially wafer level hybrid Cu-Cu bonding, for realizing high density inter-chip interconnection. 3D integration process using conductive wafer bonding and the test vehicle for bonding process evaluation are described. Different pre-bonding surface treatment methods and bonding procedures are studied and compared for yield and throughput...
TSV (through-silicon-via) has been regarded as a key technology for 2.5D and 3D electronic packaging. However, the manufacturing of the through silicon interposer (TSI) is very challenging and costly. The minimization of the warpage of the TSV interposer wafer is crucial for successful subsequent processing, for example, thin wafer handling, backside via revealing and copper pillar bumping. In this...
With the increasing need of smaller size and lower cost of wireless communication system, the integrated passive devices (IPDs) have offered a proper solution. However, small Q factor (quality factor) of integrated passive inductors seriously limits the performance of the IPDs. In this paper, a simplified circuit model of the inductor structure has been presented to extract the parasitic parameters...
Electromagnetic isolation is a critical issue to the performance of radio frequency system in package (RF SIP). This paper proposes a novel structure to measure the electromagnetic (EM) isolation property and to test the shield efficiency of a metal cap. The 3-dimensional structure contains 5 antenna chips assembled is based on rigid and flexible substrates. EM interference and EM isolation relevance...
A band-pass-filter (BPF) based on silicon substrate was designed and simulated. Different software was applied to design and simulate the character of the filter. A three-order filter was designed dedicating to range 2.4 GHz-2.5 GHz use. The ideal topology circuit was designed with passive inductors and capacitors. Moreover, the integrated passive devices (IPDs) were modeled and simulated with thin...
Passive devices are widely used in all kinds of systems. Generally, most of the passive components in an electronic system are assembled as discrete components or passive arrays. Bu t a discrete passive component occupies a lot of space for the realization of its function. To overcome this shortcoming, one promising way is the integration of passive components into system in package. In this paper,...
Glass is an ideal material for 2.5D packaging application with excellent electrical, optical and mechanical properties. In this paper, several forms of coplanar waveguide (CPW) on glass substrate were modeled and simulated using 3D full-wave finite element method (FEM). The target of this research was to provide guidance for the design and analysis of CPW on glass substrate. Analyses of CPWs on different...
Through silicon vias (TSVs) are regarded as one of the key enabling component to achieve three-dimensional (3D) integrated circuit (IC) functionality. In this paper, we present the investigation on TSV protrusion and stress at different annealing conditions tested by means of optical profiler and high efficiency micro-Raman microscopy. Finite element method is utilized to model and simulate the thermo-mechanical...
In this paper, a new high performance three dimensional radio frequency package on package (3D RF PoP) based on ceramic substrate is designed for micro base station which is able to cover the multicasting of critical messages to as many mobile users as possible even under communications network failure events, such as the failure of macro base stations. The RF PoP integrates receiver (RX) module,...
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