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This paper describes the challenges of a 17.5um thin bare Cu wire bonding on aluminum bond pads for a fragile low-k wafer technology, on a BGA package. Previous evaluations have so far focused on 20um and 25um bare Cu wires as a suitable low cost replacement for Au wires. To improve performance, more fragile low-k wafer technology is being developed. In the past, some key technical challenges experienced...
LowK technology is continuously advancing and is a technology required for higher speed and performance for a semiconductor die. However, the high manufacturing cost of producing a LowK wafer needs to be addressed. One of the methods to lower this cost is to fit as many dies into a given wafer size, be it 6, 8, or 12 inch diameter. In order to perform this task, one of the method is to reduce the...
Today's semiconductor industry continues to deliver high performance and cost effective solution. Copper wire bonding is one of the hot topics on low cost alternative packaging materials. However, copper wire bonding is still not fully established and it requires significant engineering effort especially on the C65 low k, wafer with probed Al bond pads. A thin gold wire compared to copper wire will...
This paper presented an integration method for biomedical implants by using solder bonding and highly flexible polyimide (PI) cable. The proposed integration method can overcame the problems in flexible cable assembly before. It can achieve a small form, and better reliability, and is easier for fragile MEMS device bonding by using solder bonding. Therefore, it is suitable for various MEMS devices...
This paper proposes a new technique for propagation and diagnosis the faulty LUTs (Look Up Tables) in an FPGA (Field Programmable Gate Arrays) using a simple parallel in serial out shift register. The proposed fault propagation design helps in diagnosing the multiple faulty LUTs precisely by avoiding any fault masking. This method has been tested on the commercial FPGA and the experimental results...
There are multiple die crack incidents reported on 54ld SOIC EP (Exposed pad) packages from one SMT customer. Various analytical methods were employed in order to find the root cause of the die crack, including CSAM, X-Ray, 4 point bend test, SEM & fractography analysis, TherMorie analysis and digital modeling. A series of experimentations on silicon, packaging process and SMT PCB board design...
Three dimensional (3D) IC integration technologies have become essential as the market demands for product with low power consumption, multi functions, smaller size and faster response have been increasing. 3D stacking with conventional high melting temperature solders such as SnAg and Sn may induce high thermal stress to the package. In this paper, chip to chip 3D stacking using no flow underfill...
For advanced control and optimization of inkjet-printed droplet and line morphologies, this paper seeks to provide insights into characterizing and understanding the transient behavior of the inkjet droplet on different surface conditions and substrate temperatures. The transient behavior of contact angle of tested fluids includes deionised water and glycerol solution is discussed. Fluids with different...
Inkjet etching has been identified as a potential route to formation of micro via holes in polymer dielectrics. Such vias could facilitate three-dimensional integration and sequential build-up fabrication in printed electronics. In the research reported in this paper, ethanol droplets were jetted onto a poly(4-vinyl phenol) (also known as PVP or PVPh) layer at different frequencies in order to observe...
For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal...
Head-in-pillow (HIP) defect is a growing concern in the electronics industry. This defect is usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors to the HIP defect are: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal re flow profile, and warpage...
Some discrete power packages require very stringent die attach requirements such as overhang die on upset leadframe. This type of packages shows physical weak point at the epoxy layer whereby reliability stress easily propagate separation near the junction of overhang die and leadframe upset curvature. Normal solution of implementing treated leadframe was not feasible because there was very little...
This paper presents the process and equipment challenges faced with the introduction of single mold cap BGA assembly, with the main focus on End Of Line assembly processes. The design of the single mold cap without the stress relieve slots would subject the substrate to high warpage after the molding process. This high warpage may lead to handling and process issues at molding, ball attach, laser...
In order to increase the sensitivity of a piezoresistive pressure sensor, the membrane needs to be very thin or very large to achieve good results. But there is a trade-off between stability, linearity and sensitivity. The thinner the membrane, the more instable is the sensor structure. The original sensor developed for wall pressure measurement has a membrane thickness of 4 μm. The herein presented...
Virtual prototyping is able to speed-up the development cycle of new products if based on exact models. In case of dynamic mechanical loads like JEDEC drop tests of BGA modules, broken copper traces at the PCB side are more and more often observed to be the ultimate failure effects. Straightforward FEM simulations showed unrealistic high stress and strain results not matching with the experimentally...
Through-silicon-via (TSV) technology permits devices to be placed and wired in the third dimension. Currently, there is a strong motivation for the semiconductor industry to move to 3-D integration using the TSV approach due to many advantages of TSV application. However, there are also some challenges for stacked die package with TSVs. One of the challenges is thermo-mechanical reliability of multi-layer...
Assembly methods with specially designed Si interposer and Si platform are described for low profile 3D neural probe array assembly in this paper. In this method, in order to assemble the probe array with low profile and connect the probe with ASIC chips, an interposer is designed to connect the electrical pads on the sidewall of the probe and the electrical pads on the surface of the Application-specific...
Micro mirror packaging development for pico-projector application requires integration of magnets, silicon spacer and glass cap. A multilayer stack package has been designed for large deflection micro mirror. The magnets are used for electromagnetic actuation and are attached on either sides of the silicon beam by a pick and place machine. Different epoxy materials are evaluated to optimize the magnet...
Spray cooling has remained one of the highest heat flux removal schemes across various applications such as cooling power electronics, lasers, high power LEDs, servers, supercomputers etc. Researchers have been researching extensively to obtain the maximum heat transfer coefficient. The effects of different parameters of the spray cooling system have been studied in the past. The focus of the present...
Wide bandgap materials have become very attractive for power electronics due to their physical properties that allow junction temperatures up to a theoretical limit of 600°C. In contrast, the maximum operation temperature of conventional silicon semiconductors is limited to approximately 200°C. The high-temperature operation of wide bandgap switches allows an increasing power density of power converters...
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