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Under the new technical condition, the promotion of equipment complexity and high-tech features makes a significant increase in the workload of equipment support. Commands of support organizations become more complex. In order to meet these demands, the equipment support system has gradually evolved to the network structure. Network-centric equipment support system will become the development trend...
The wafer level ball grid array (WLBGA), a silicon die-size package, offers the small form factor and highperformance packaging solution. Good board-level reliability under drop impact is achieved on account if its light weight. There is, however, a limitation on the reliability of the solder joint at board level, subject to thermal cyclic loading. This places a limit on the silicon die-size window...
Presence of a thermal enabling load applied to Ball Grid Array (BGA) components creates a distinctive set of evaluations to be completed for reliability of solder joints (SJ) that connect the BGA to the board. This becomes especially relevant for newer technologies that drive to smaller component form factors. In this comprehensive study, a computational mechanics based Design of Experiments approach...
This paper presents the design and modeling of the MEMS mechanical fatigue in the presence of stress raising notches. FEM models are realized to study the effect of notch geometric parameters on the stress concentration factor of the gold specimen subjected to tensile loading. Test structures with three different specimens, i.e. without notch, with single notch and with a double notch are modeled...
Considering the influence of the cost, reliability and environment issues, the lead-free material of solder connection is paid more and more attention in integrated circuit packaging field. As the substitute of traditional solder, conductive adhesive has its own advantages. In this paper, a ball grid array (BGA) is chosen to illustrate the fatigue model for the methods of strain-based and energy-based...
Linear elastic fracture mechanics (LEFM) approach was used for studying the influence of the interfacial IMC layer thickness and solder mask layer thickness on fracture behavior of ball grid array (BGA) structure solder interconnects using finite element numerical simulation. The stress intensity factors (SIFs, KI and KII) at the crack tip of a predefined face-crack in the IMC layer of BGA joints...
As part of the collaborative research centre 653 (CRC 653) at the Leibniz University of Hannover, sensors and sensitive materials are being developed which can be integrated into components and register the component condition directly. The part-project "Component status driven maintenance" presented here, develops the methodical procedure for being able to use these sensors in preventive...
The residual strength prediction and assessment of panels with MSD is very important to aged airplane. This paper presented the load-sharing parallel system reliability model to assess residual strength of this kind of structure. The model treated the structure as a load-sharing parallel system with different type components since different ligaments have different area. The probability distribution...
This study examines evolution characteristics of inelastic strains and materials damage in Sn-4Ag-0.5Cu (SAC405) solder joints of a BGA package under cyclic mechanical stressing. For this purpose, a finite element model of the assembly under four-point bend test set-up is employed. Strain rate-dependent response of the solder is represented by Anand model. Progressive damage in the solder joint is...
As the high redundancy of network equipments and paths, connection reliability is no longer the most important parameter for networks. According to network function, this paper advances transmission time reliability as a common parameter to describe network congestion. It is defined to be the probability that networks will transmit material, energy or information timely when used under specified operating...
Electronic assemblies in field use are exposed to a wide range of environmental loads. The interaction of combined loads has to be considered in lifetime estimates of electronic packages. In this paper, we discuss lifetime prediction for lead-free soldered flip chips under vibration load in different temperature environments in terms of solder joint fatigue. Parameters for lifetime modeling are obtained...
The nanoindentation experiment is an established technique for the determination of hardness and Young's modulus of thin films. This standard data set is not sufficient to be used as input to finite element simulations , because elastic-plastic material data is being required for analysis of reliability of metal layers. Therefore stress-strain curves are being determined by fitting the force displacement...
With the requirements of miniaturization of the portable consumer electronic products, more and more new materials, fabricating process and technologies are used to make the electronic components flexible, bendable and wearable. Flexible display, as one of the most important components, recently attracts an enormous research interest in industry and university. With the application of these technologies,...
The technique of wafer level chip scale package (WLCSP) is similar as flip chip packages without using underfill. The weakest point is solder joint reliability issue so the package size of WLCSP in current industry is used less than 10times10 mm2. In this paper, we use 5.5times5.5 mm2 package size to take as test vehicle and focus on ball peeling and shear stresses to assume and simulate drop test...
Flexible printed circuit boards (fPCBs) have an important role in electronic product miniaturization due to their reduced thickness and ability to bend and adapt to various shapes. As with any new technology reliability should be assessed to guarantee quality of products that benefit from the additional features. Typical causes of cracking failure in electronic devices are related to mechanical stress,...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Drop/impact causes high strain rate deformation in solder joints of microelectronics package. It is important to understand mechanical behavior of solder joints under high strain rate for reliability design of products. In this paper mechanical behaviors of two lead-free solder alloys, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated by quasi-static tests and the split Hopkinson tension/pressure bar testing...
The solder joints reliability of electronic packages during board level drop impact is a great concern for semiconductor manufacturers. Many researchers have adopted numerical simulation to investigate the drop performance of electronic package because it is fast and cost-effective. However, the solder balls, which are recognized as vital parts for the integrity of solder joints and the overall function...
A physical yet analytical phase change memory (PCM) model simultaneously accounting for thermal and electrical conductivities is presented. Due to the physics based nature of the model, the essential temperature from heating and cooling of PCM during operation is instantaneously updated. More importantly, the model can be applied to non-conventional circuit design technique. We show that for the first...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
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