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The paper presents the history and basics of flip chip technology, elements of design and manufacturing, packaging configuration, flip chip reliability, current issues for density, requirement for new materials and future direction, and the Japanese packaging technology trend. This short course provides information of flip chip technology with fundamental theory and characteristics through the most...
Moore's law has been the most powerful driver for the development of the microelectronic industry. This law emphasizes on lithography scaling and integration (in 2D) of all functions on a single chip, perhaps through system-on-chip (SoC). On the other hand, the integration of all these functions can be achieved through system-in-package (SiP) or, ultimately, 3D IC/Si integration, which is a very complicate...
Semiconductor manufacturing is trending to become more competitive and fast-paced in achieving efficient productivity. While striving to meet the goal of minimizing complexity and cost reduction, the challenges for equipment end user are maximizing its functionality and flexibility. With higher product volumes and increasing number of products requiring unique equipment configurations, it is sound...
Mobile electronics growth has recently been supported by the integration of more features for higher end devices. Smart phones are indeed growing at much faster pace than the overall mobile phone market. Requirements towards packaging are therefore asking breakthrough innovation to allow best package integration at optimized cost. Recent progresses in 3D eWLB packaging and integration will be addressed...
This conference paper concerns the application of optical character recognition in the processing of thermal images. Thermal images that lack colour index metadata are subjected to a custom-made program, which performs the aforementioned tasks. The temperature values corresponding to the color intensities of every pixel in an image can be determined without the need to manually input details of the...
The high demand for long wavelength lasers has led to the investigation of GaInNAs material. GaInNAs multiple-quantum-wells (MQWs) with different QW numbers have been studied for ridge waveguide (RWG) lasers. The emission wavelengths of the lasers are in the range of 1310 nm. Significant improvements of emission wavelength and output power were demonstrated with increasing QW numbers. We believed...
The keynote speaker will provide an insight into today IC test systems and test handlers and their challenges and selection. The key test blocks (functional test or parametric) and key test functions will be examined and illustrated. Interesting case studies on test program and control and limitation for packaging qualification will be discussed in detail including some tips to meet future packaging...
This paper suggests an improved method to round off the concave corners of the deep trenches formed by plasma etch. The corner rounding technique, sacrificial oxidation (SACOX) before gate oxidation, has been practiced on the shallow trench isolation (STI) to improve the CMOS leakage performance. However, the direct implementation of the SACOX on the deep trenched MOSFET having less than 0.5 um trench...
Intel's Moore's Law focuses on shrinking the transistors in the silicon to be able to pack more and more transistors for a given area. In general, Intel has been able to double the transistor count every 18–24 months and has been doing so while keeping the silicon size at about the same size or even smaller. The key implication to that trend has been the I/O density that needs to be routed through...
In this paper, we present the copper-copper bonding technique by ultrasonic welding for the copper terminals of large current, high reliability IGBT modules. Investigated topics are joint strength indicated from joint microstructure, the effect of copper hardness on joint strength, the relationship between terminal bonding location and the damage to the insulator layer in the module structure, and...
This paper focuses on the 1.0 mil Cu wire development and its reliability performance mainly at component level of a BGA wire bond package which consists of 2 metal layer organic substrate more than 500 pin counts. This paper covers package reliability tests such as THB (Temperature and Humidity Biased test), unbiased HAST, TCB (temperature cycling B), high temperature storage tests on BGA laminate...
FMEA or Failure Mode Effects Analysis is an analytical procedure to identify and minimize risk factors in product and process designs. Whilst the FMEA methodology has been in use since the 1940's, the effectiveness of the procedure became really widespread after its adoption by the automotive industry in the late 1970's. The FMEA procedure is a preventative tool and hence must be performed prior to...
Copper (Cu) wire bonding is the most viable alternative interconnection technology to gold (Au) wire bonding when cost is considered. Recent developments in bonding technology and capability has resulted in copper wire bonding being targeted at high pin count and high performance applications such as ball grid array packages. Wire sweep performance is extremely important in high I/O products as slight...
As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonded ball hardness are 34% and 60% higher than that of Au, hence increases the stress on bond pad and chip...
According to the evolution between each new technological generation of CMOS ICs, ITRS suggests a reduction in interconnect sizes by a factor of around square root of 2. In this paper a reference design rule is based on a perfectly controlled technology of the CMOS 45 nm node, with interconnects width equal to their separation space. Our works are focused on the impact on signal transmission speed...
Leveraging semiconductor industry trend today, there is a massive growing demand for module package at end customers' application. This is essentially due to benefits from system in package as a complete solution for ease of use, miniaturization, enhanced thermal, EMI shielding and low cost IC packaging.
A collection of slides from the author's presentation is discussed. The topics include ultra low-CTE polyimide laminate sheet and its reliability test.
Encapsulation of large QFN packages (>; 5 × 5 mm) are quite challenging as compared to normal small QFN packages as the big die pad in leadframe and multiple narrow gaps between leads may caused mold void rejects at the half etch areas. High density of fragile wires is prone to have wire sweep too as the EMC flow impact on longer wire length is significant which can caused wires sweep during mold...
Titanium alloys are commonly used in biomedical application in hard tissues replacement especially for knee and hip implants but facing huge wear debris due to continuous cyclic contact within the joints of the implants. Diamond coating is a potential solution for improving the tribological and wear properties of the implants made from this alloy. Diamond is known for having high wear resistance property...
With the technology advancing, most products are getting more personalize with various variety. Hand held products that are larger than palm size has no longer favor one's interest; the miniature product is the future, its means smaller, lighter and portable. Miniaturization product can be succeeded by reducing package size and the integration of ultra-small component (0402, 0201, 01005). SIP-MCM...
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