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In this paper we discuss the lifetime prediction for Pb-free soldered flip chip components under combined temperature cycling (TC) and vibration loading in terms of the failure mechanisms related to solder joint fatigue. We show the results of several experiments including failure analysis and comparison of lifetime models. For this purpose finite element analyses (FEA) of the thermal cycling and...
This paper presents the electrical measurement of interconnect degradation in micrometer scale. For this approach the changes in a RF measurement signal under artificial interconnect aging conditions are used. Therefore, scattering parameters (S-parameters) are measured and evaluated. This technique overcomes the drawbacks in sensitivity of the more traditional measurement approaches. Test samples...
Further miniaturization of electronic systems is approaching new limits due to the failure mechanism of electromigration. Electromigration results in a transport of material in solder joints subjected to high electrical current densities. This decreases the system reliability and, therefore, it is necessary to assess and quantify this failure mechanism in solder joints. In this paper we discuss the...
Electronic assemblies in field use are exposed to a wide range of environmental loads. The interaction of combined loads has to be considered in lifetime estimates of electronic packages. In this paper, we discuss lifetime prediction for lead-free soldered flip chips under vibration load in different temperature environments in terms of solder joint fatigue. Parameters for lifetime modeling are obtained...
Mechatronics use the synergies from the interaction of electronics, mechanics and information technology. It covers a wide range of components, interconnection technologies, and application specific software. Mechatronics design is a multi-domain exercise involving concurrent design evaluations and respective decision making in various fields of engineering. Whereas small form factors and the improvement...
The implementation of energy scavenging technologies in distributed, self-sufficient micro systems offers new approaches to the realization of long-time power supplies within reasonable system dimensions. In this article various technical solutions to supply a low-power micro system with basic functions and fixed energy requirements are examined from an environmental point of view. Based on the material...
Micro systems with autonomous energy supply exhibit a high potential for the realisation of highly miniaturised, cost- and material-efficient wireless sensing applications. The conversion of electromagnetic, thermal and kinetic energy from the ambient environment into electric energy by means of 'energy scavenging' is an approach to support or even replace primary batteries to in long-term applications...
Environmental policy making, green product rating, and marketing activities seem likely to drive the utilization of eco-assessments in the near future. In this paper we show from the example of EuP Preparatory Studies and other policy supporting studies some characteristics of ICT eco-assessments on different economical levels. We argue that the high diversity of individual cases coupled with technology...
Electronic systems are exposed to a variety of environmental impacts causing multiple degradations of important characteristics such as signal propagation. Interconnect failures due to environmental stress are most often cracks. The ability to measure growing fatigue cracks on strip line conductive paths or solder joints is a desirable feature for reliability estimation of electronic assemblies. In...
The framework directive for ecodesign of energy using products (EuP) has been in force in Europe since 2005 already, but only now the process for setting eco-requirements for specific products is becoming clear. The paper explains the results of the so-called preparatory studies, which prepare the definition of eco-requirements, and the current state of the policy process. From the current planning...
After the repercussions of the introduction of RoHS and WEEE have slowed down, and the first revisions are on the way, the focus in environmental legislation for electronics is shifting in two major directions: the internationalization of RoHS- and WEEE-like requirements and potential new requirements especially from EuP and REACh directives. After giving an overview of the status of substance restriction...
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