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This paper brings into light the first prototype miniaturized system-in-package (SiP) microsystems built for wireless body-area-network medical devices which mandate low power consumption and extreme packaging miniaturization. Specifically, this paper focuses on the fabrication of a remote controller for wireless medical devices in the practical shape of an extended “microSD” card where the extended...
Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips, System-on-Chip...
This paper brings into light the first prototype miniaturized system-in-package (SiP) Microsystems built for wireless body-area-network medical devices which mandate low power consumption and extreme packaging miniaturization. Specifically, this paper focuses on the scenario for a 3D-SiP module for wearable demonstrators, namely hearing aids and insulin pups, with an active antenna integrated on top...
Power electronics for automotive applications has strong demands regarding reliability and cost. Especially the upcoming hybrid cars and fully electrical vehicles need compact and efficient power modules. Conventionally components like IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics and their top contacts are connected by thick Al wires. These ceramic modules are soldered to water-cooled...
The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compartment installation space is of major concern. Therefore small size and high integration level of the modules are needed. Conventionally IGBTs and diodes...
This paper brings into light the first prototype miniaturized system-in-package (SiP) Microsystems built for wireless body-area-network medical devices which mandate low power consumption and extreme packaging miniaturization. Specifically, this paper focuses on the first scenario for a 2D-SiP module for implantable demonstrators, namely cochlear and cardiac implants, with a passive antenna integrated...
In coming applications a further increase of diversity and higher complexity of electronic systems is expected. As a consequence it will be an increasingly challenging and time consuming task to design these systems. Although various new components are coming up, the problem of increasing cost for system design, debugging and verification is generally not addressed by conventional technology developments...
At PCB manufacturing level, 50 µm thin chips have been embedded with pitches up to 200 µm in up to 18″×24″ panels using face-down technology for chip assembly. This paper describes in detail the merits and shortcomings of both face-down and face-up embedding. In addition, it shows the further developments in chip embedding technologies to incorporate chips with even smaller pitches up to 50µm. Embedding...
In coming applications a further increase of diversity and higher complexity of electronic systems is expected. As a consequence it will be an increasingly challenging and time consuming task to design these systems. Although various new components are coming up, the problem of increasing cost for system design, debugging and verification is generally not addressed by conventional technology developments...
During the past decade embedding of semiconductor chips into printed circuit board structures evolved from a research topic to volume production. The paper will briefly describe this development and categorise today's embedding technologies. First modules with embedded chips are in production in Asia, mainly for telecom and computer applications. In Europe embedding has gained a strong interest for...
This paper details the newest developments in chip embedding technologies for chips with a pitch of 100µm. The technology developed in this study does not necessitate expensive redistribution layers for enlarging the pad pitch. Embedding of small pitch chips has been realised with concurrent developments in accurate chip positioning, plating methods and chemistries and ultra fine line patterning....
Driving packaging cost down is essential to make products cheaper. There are several options to reduce costs: One is to switch from one packaging technology to another (cheaper) one. The other is to cut costs for an existing process step by using cheaper material and/or a more cost effective process flow. For 3-D-packages dry films can be used as a photo mask for Si dry etching. They do have the capability...
Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded thin components. This paper shows the realisation of embedded chip QFN-packages (Quad Flat No-Lead) with a size of 10mmx10mm which were manufactured at prototype level at 10"x14" panels. The embedded chip in the package has a pad pitch of 100??m and...
Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded components. Among its merits, it provides superior electrical performance by short and geometrically well controlled interconnects as well as a homogeneous mechanical environment for the chips and thus resulting in superior reliability. At PCB manufacturing...
At R&D level, IZM has advanced stencil printing very close to its technological limits at pitches even down to 50 mum. Innovative electroformed and laser-cut with nano-treatment stencils have been manufactured with an extreme thinness of 20 mum for bumping wafers at ultra fine pitches (UFP) of 100 mum, 80 mum and 60 mum. Specifically, for 100 mum pitch bumping, both type 7 (2-11 mum) and type...
The chip embedding technology achieved significant progress the last years. After various research activities the main focus is today on industrialisation and implementation of new business models. In the project HERMES European partners from industry and research aim to bring embedding technology based on low-cost PCB /Printed Circuit Board) processes to a market-ready product flow, demonstrated...
In this paper the realization of packages and system-in-packages (SIP) with embedded components will be described. Embedding of semiconductor chips into substrates has several advantages. It allows a very high degree of miniaturization due to the possibility of sequentially stacking of multiple layers containing embedded components. A further advantage is the beneficial electrical performance by short...
Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded components, superior electrical performance by short and geometrically well controlled interconnects as well as a homogeneous mechanical environment of the chips, resulting in good reliability. At PCB manufacturing level, 50 mum thin chips have been embedded...
This paper brings into light a new ultra-thin and highly flexible package with embedded active chips. In this technology, no supporting and permanent substrates were needed. Copper foil was used as temporal substrate, and it became the bottom circuit after patterning and etching processes. Ultra-thin chips with 20~25 mum thickness were assembled directly on the structured copper foils in a flip-chip...
There is a steady trend to decrease bump pitch and the total cost for the bumping process. Several techniques for bumping are available such as screen printing of solder paste through metal stencils, electroplating of bumps, ball placement or C4NP. Initially there appears to be a number of choices for bumping, however after looking at the details the choices are significantly reduced. The use of ball...
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