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A printed circuit board (PCB)-based platform for potentiometric chemical sensing in liquid media is proposed. The sensors’ general design and specific issues regarding the reference and indicator electrodes are discussed. Initial experimental data and details of the construction of a solid-state reference electrode (SSRE) are presented. The results are promising and a first step towards the development...
This paper brings into light the first prototype miniaturized system-in-package (SiP) microsystems built for wireless body-area-network medical devices which mandate low power consumption and extreme packaging miniaturization. Specifically, this paper focuses on the fabrication of a remote controller for wireless medical devices in the practical shape of an extended “microSD” card where the extended...
This paper brings into light the first prototype miniaturized system-in-package (SiP) Microsystems built for wireless body-area-network medical devices which mandate low power consumption and extreme packaging miniaturization. Specifically, this paper focuses on the scenario for a 3D-SiP module for wearable demonstrators, namely hearing aids and insulin pups, with an active antenna integrated on top...
Power electronics for automotive applications has strong demands regarding reliability and cost. Especially the upcoming hybrid cars and fully electrical vehicles need compact and efficient power modules. Conventionally components like IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics and their top contacts are connected by thick Al wires. These ceramic modules are soldered to water-cooled...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area.
The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compartment installation space is of major concern. Therefore small size and high integration level of the modules are needed. Conventionally IGBTs and diodes...
This paper brings into light the first prototype miniaturized system-in-package (SiP) Microsystems built for wireless body-area-network medical devices which mandate low power consumption and extreme packaging miniaturization. Specifically, this paper focuses on the first scenario for a 2D-SiP module for implantable demonstrators, namely cochlear and cardiac implants, with a passive antenna integrated...
In coming applications a further increase of diversity and higher complexity of electronic systems is expected. As a consequence it will be an increasingly challenging and time consuming task to design these systems. Although various new components are coming up, the problem of increasing cost for system design, debugging and verification is generally not addressed by conventional technology developments...
At PCB manufacturing level, 50 µm thin chips have been embedded with pitches up to 200 µm in up to 18″×24″ panels using face-down technology for chip assembly. This paper describes in detail the merits and shortcomings of both face-down and face-up embedding. In addition, it shows the further developments in chip embedding technologies to incorporate chips with even smaller pitches up to 50µm. Embedding...
In coming applications a further increase of diversity and higher complexity of electronic systems is expected. As a consequence it will be an increasingly challenging and time consuming task to design these systems. Although various new components are coming up, the problem of increasing cost for system design, debugging and verification is generally not addressed by conventional technology developments...
During the past decade embedding of semiconductor chips into printed circuit board structures evolved from a research topic to volume production. The paper will briefly describe this development and categorise today's embedding technologies. First modules with embedded chips are in production in Asia, mainly for telecom and computer applications. In Europe embedding has gained a strong interest for...
This paper details the newest developments in chip embedding technologies for chips with a pitch of 100µm. The technology developed in this study does not necessitate expensive redistribution layers for enlarging the pad pitch. Embedding of small pitch chips has been realised with concurrent developments in accurate chip positioning, plating methods and chemistries and ultra fine line patterning....
The scope of the European project TIPS (Thin Interconnected Package Stacks) is the fabrication of ultra thin packages for electronic components and the subsequent stacking and interconnection of those packages to form highly compact modules. In the first part of this paper approaches to fabricate ultra thin 10 × 10 mm packages by embedding technologies for chips into printed circuit board environments...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing with potential for low cost applications. Wafer level embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. This paper describes the use...
Commonplace electronic appliances for consumer or industrial use are still mostly rigid or at maximum flexible entities. The flexibility of foldable units like laptops or cell phones is usually realized through flexible circuit board (FCB) interconnectors. Although flexibility allows for considerably enhanced degrees of freedom in design, it is not compatible with more complex three dimensional curvatures...
Today's electronic systems are based on an assembly of components onto rigid or flexible substrates, serving perfectly the needs of traditional product fields like automotive, computing or industry electronics. On the other hand, many of the demands from emerging applications like wearable and textile electronics cannot be met if standard technologies are used for their realization. These new fields...
Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded thin components. This paper shows the realisation of embedded chip QFN-packages (Quad Flat No-Lead) with a size of 10mmx10mm which were manufactured at prototype level at 10"x14" panels. The embedded chip in the package has a pad pitch of 100??m and...
An innovative technology for the mass production of stretchable printed circuit boards (SCBs) will be presented in this paper. This technology makes it possible for the first time to really integrate fine pitch, high performance electronic circuits easily into textiles and so may be the building block for a totally new generation of wearable electronic systems. An overview of the technology will be...
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