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Preheating is considered to be an effective method to improve the resolution of inkjet printing conductive tracks. However, although preheating can accelerate the evaporation of the droplets, it also changes the surface condition of substrate, which affects the spreading behaviour of the droplets. In this study, four types of commonly used substrates are employed to investigate the effect of preheating...
This paper deals with the dispensing of viscous materials, focused especially on thick film pastes and thixotropic materials. The main aim of our solution is to reduce the viscosity of paste and thus ensure better conditions for the deposition during deposition process. The basic classification of dispense systems into groups depends from the discharge of material. There are two main principles; the...
There is a growing requirement for distributed sensors to measure, monitor and control systems such as airframes, wind turbines, engines, power trains, human motion and seismic sensors. These type of devices need to be as unobtrusive as possible and miniaturisation of the sensor and its control circuitry is a key factor in achieving this. This paper reports on a method of combining the sensor element...
With the miniaturization of electronic productions and the use of heat sensitive electronic components, the traditional reflow soldering process often has difficulties. As an alternative soldering process, the laser soldering process has been recently proposed. The laser soldering process brings several advantages in terms of localized heating, rapid rise and fall in temperature, non-contact and easily...
Interconnections have an important role in packaging as they not only provide electrical connection but they also act as mechanical attachment between connected substrates and are supposed to be as reliable as possible. This paper describes design, construction and some recent laboratory tests of 3D stacked structures, where different materials with different coefficient of thermal expansion are combined...
Since the late eighties of the last century, digital ink-jet technology has been widely explored by the electronic industry in developing new manufacturing processes. Nowadays, ink-jet printing technology is increasingly being used to create the electrically conductive structures on flexible substrates. Ink for printing conductive microstructures is typically based on noble metals of nano-sized dimensions...
Inkjet printing of planar and via (through-hole) electrical interconnections is developed to be incorporated into a roll-to-roll manufacturing line. The specific roll-to-roll machine uses rotary RMPD® technology, self-alignment of bare LED dies, and inkjet printing of the electrical connections to the LEDs dies. The key problem to be solved is the inkjet printing of electrical connections through...
The rapid ramping of fine pitch copper wire bonding production is a perfect example of a market driven technology implementation. The explosive increase in gold commodity pricing has paved the road for this conversion. Several challenges known from thick copper wire bonding had to be overcome to make this technology viable technically and economically. Some fundamental studies of copper wire bonding...
Electromigration behavior of Sn-3.0wt%Ag-3.0wt%Bi-4.0wt%In (SABI) and SABI+Co solder joints with respect to the crystallographic orientation of Sn grains was investigated. The test sample had direct contact on Cu substrate with Cu dummy chip and the applied direct current was 20 A at 125 °C solder joint temperature. Before current stressing SABI solder solidified to form large Sn grains. After current...
Flip chip packaging used to be the domain of micro processors and ASICs. Application processors were next to adopt flip chip packaging in high volume. Both types of packaging were based on solder interconnects, initially PbSn eutectic solder on organic substrates and then later Pb-free solders. In order to solve electro migration issues, micro processors adopted Cu pillars. Flip chip packages are...
After a short introduction into one actual development in the field of chemical reaction engineering, the requirements resulting from the application of sensors in a chemical reactor are shown. Physical quantities of interest when investigating and running chemical reactions are specified. As an example, the implementation of a multi-channel temperature sensor is described. Due to the chosen sensor...
Gold (Au) wire bonding is one of today's most common and well understood first level interconnects. However copper (Cu) wire bonding is increasingly being used for a wide variety of components, predominantly driven by the cost benefit of Cu. As the application moves from mostly consumer products to high-reliability electronic systems, the long term reliability of fine-pitch Cu wire bonding must be...
In this paper the initial capacitances of pressure sensors consisting primarily of the capacitance of an air-gap capacitor and the parasitic capacitance of sensors realized with LTCC (low-temperature cofired ceramics) materials are described. The capacitances at different temperatures (from 10°C to 75°C) and different levels of humidity (from 20% to 80% relative humidity) were measured with an LCR...
Lead-contained and lead-free solder joints have been well studied in electronics packaging applications over the past years. Within the solar industry, establishing the Si crystalline solar cell interconnection process as an environment friendly and RoHS-conform process, more substantial investigations are necessary to prove the process reliability and characterize interconnection formation in the...
The requirements for reduction of line and space dimensions in IC substrates are driving developments to improve both production yield and capability. In particular the production of substrates with line and space dimension at or below 10 µm is required for the next level of integration. However traditional production techniques using dry film image transfer are already reaching capability limits...
This paper presents computational fracture analysis of the button shear test. The specimen under consideration is commonly used for the assessment of adhesion strength between encapsulating mold compounds and metal leadframes. The finite element method is applied for stress strain analysis of the shear test and for the extraction of fracture parameters for various crack configurations in the material...
This paper describes experiment where model of thick film inductor was created, simulated and verified. For simulation, the FEM (Finite Element Method) was used. In this paper are shown graphical outputs of simulation. Next part of this work was experimental verifying of obtained results. For this, testing sample was designed, manufactured and measured. Measured values were statistically evaluated.
Fresnoite, Ba2TiSi2O8, possesses a very intense and broad photoluminescence band similar to that of the most intense oxide scintillator materials. As such, fresnoite is to be considered a well-suited material for photonics applications, including phosphors. Complete miscibility with the isotypic fresnoite compounds Ba2TiGe2O8 and Sr2TiSi2O8 as well as doping with rare-earth ions facilitates colour-space...
A high performance, high operating temperature electronic module technology has been researched and developed that achieves reliable operation for 1000 hours at 225 Deg C.
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