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This paper brings into light the first prototype miniaturized system-in-package (SiP) microsystems built for wireless body-area-network medical devices which mandate low power consumption and extreme packaging miniaturization. Specifically, this paper focuses on the fabrication of a remote controller for wireless medical devices in the practical shape of an extended “microSD” card where the extended...
Power electronics for automotive applications has strong demands regarding reliability and cost. Especially the upcoming hybrid cars and fully electrical vehicles need compact and efficient power modules. Conventionally components like IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics and their top contacts are connected by thick Al wires. These ceramic modules are soldered to water-cooled...
At PCB manufacturing level, 50 µm thin chips have been embedded with pitches up to 200 µm in up to 18″×24″ panels using face-down technology for chip assembly. This paper describes in detail the merits and shortcomings of both face-down and face-up embedding. In addition, it shows the further developments in chip embedding technologies to incorporate chips with even smaller pitches up to 50µm. Embedding...
During the past decade embedding of semiconductor chips into printed circuit board structures evolved from a research topic to volume production. The paper will briefly describe this development and categorise today's embedding technologies. First modules with embedded chips are in production in Asia, mainly for telecom and computer applications. In Europe embedding has gained a strong interest for...
This paper details the newest developments in chip embedding technologies for chips with a pitch of 100µm. The technology developed in this study does not necessitate expensive redistribution layers for enlarging the pad pitch. Embedding of small pitch chips has been realised with concurrent developments in accurate chip positioning, plating methods and chemistries and ultra fine line patterning....
Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded thin components. This paper shows the realisation of embedded chip QFN-packages (Quad Flat No-Lead) with a size of 10mmx10mm which were manufactured at prototype level at 10"x14" panels. The embedded chip in the package has a pad pitch of 100??m and...
The chip embedding technology achieved significant progress the last years. After various research activities the main focus is today on industrialisation and implementation of new business models. In the project HERMES European partners from industry and research aim to bring embedding technology based on low-cost PCB /Printed Circuit Board) processes to a market-ready product flow, demonstrated...
In this paper the realization of packages and system-in-packages (SIP) with embedded components will be described. Embedding of semiconductor chips into substrates has several advantages. It allows a very high degree of miniaturization due to the possibility of sequentially stacking of multiple layers containing embedded components. A further advantage is the beneficial electrical performance by short...
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