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After temporary bonding and thinning process, many backside processes will be conducted on the thinned wafer. The critical processes for thin wafer handling material are high temperature and high vacuum processes. In this article, a quick adhesive selecting method is proposed. Backside process of PECVD SiO2 is identified as the most critical process for thin wafer handling material selection. Two...
This study investigates the dissolution behavior of metallic substrates-Ni and IMC-Ni3Sn4 phase in molten Sn, SAC, SC, SB and SZ at 240, 270, and 300°C. The dissolution rates of the Ni substrate in molten solder follow the order Sn > SAC > SC > SB > SZ. Many the Ni3Sn4 phases with a small grain size were formed at the Sn/Ni system. Because a small grain could provide more groove to let...
A method for breaking a through-silicon-via (TSV) and forming a clean cross-section is investigated. We use focus-ion-beam (FIB) and diamond saw to create the notches that induce the crack passing through TSV precisely. Bending the sample with two side notches of diamond saw revealed the notch of diamond saw may cause the breaking failure. Only one side notch of silicon sample is an accurate breaking...
In this work, we compared the robustness of transparent polypyrrole thin film deposited on glass substrates treated with various organosilanes. Our results show that the interfacial adhesion of polypyrrole thin films on glass substrates were better improved when the glass substrates were treated with N-(3-trimethoxy-silylpropyl) pyrrole or 3-aminopropyltriethoxysilane (APTS), but less satisfactory...
In recent years, Pb-Sn solders have been commonly applied in the microelectronic packaging industry over last decades due to their remarkable properties, such as good wetting, low melting temperature and low cost. Nevertheless, because of the toxic Pb element in the solders, significant environmental and health issues are created. Due to the high environmental awareness, green electronics products...
The combination of specialized equipment and new copper via fill chemistry offers end users a cost effective, highly capable and production proven process for IC package substrate microvias filling.
The Sn-Bi solder is a very common lead-free solder used in electronic packaging due to its low eutectic temperature (138°C). Copper is generally used as the substrate in a printed circuit board (PBC) and a metallic pad in the integrated circuit (IC) fabrication. Cu is also used as the under-bump metallurgy (UBM) of the flip chip (FC) package. Thus, for reliability of a solder-joint, it is necessary...
A printed circuit board (PCB) is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. A new PCB technology, developed by German company — JUMATECH, called WIRELAID brings possible cost reduction and more design space. By attaching discrete copper wires onto...
Consumer electronic products are evolving toward smaller size and higher efficiency. 3D IC packaging has smaller form factor and lower signal delay compared with conventional packaging. Thus, it has been widely used in mobile electronic devices. Mobile electronic device is prone to being dropped during operation. Hence, the drop reliability of electronic packaging is an important issue in 3D ICs....
The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 – 5 µm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the ?-Cu6Sn5s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu6Sn5 were...
Bosch reactive ion etching is widely used for TSV formation. The micro-masking formed during etching can be successfully removed by adjusting the internal parameters during etching. The smooth high-aspect-ratio TSVs were further developed in wafer-level fabrication. Finally, a two-step etching process was developed to achieve tapered TSVs for the following Cu plating process.
Simulation results showed that the models which consist of the pillar array structure induced more droplet collisions than those models constructed by the circle block, semi-circle block, ellipsoid block, and bevel fins, and avoided the deflection of the droplets which was revealed in the serpentine model. In addition, within the VLM chip, the wall temperature was much higher than the fluid temperature...
Recently, there are many researches on the design of RF probes. Usually the materials of RF probe are tungsten and copper beryllium. They employed fabrication process of soldering and drawing of metal wire, which are not compatible with MEMS or IC fabrication process. Precise and high skill assembly is needed to finish the final probe module therefore results in high cost. This paper presents a novel...
Within this paper, four different pitches of Through Silicon Via (TSV) of single-ended ground-signal-ground (GSG) signaling configuration with redistribution layer (RDL) and testing pad that ranging from 20 µm, 50 µm, 100 µm to 200 µm has been made to verify the Radio-Frequency (RF) characteristic of TSV. We propose the modified RF electrical equivalent model of TSV with its' de-embed patterns. With...
Failures like short circuit are always encountered in PCBs (printed circuit boards) due to defects in the flexible interconnection. In this paper, systematic analysis such as macro and micro observation was carried out on shorting trace in Polyimides (PI) films used for flexible substrates interconnection (FSI) packaging applications. The thin flexible PI films have desirable properties for use in...
Creep Corrosion is the common factor to cause electronic products failed. Cloud Computing is getting more and more popular in recent years so people's daily life correlate closely to Cloud Computing. Many global companies built the huge data center in different countries. The challenges Cloud Computing facing are Transmission Technology, Cooling System, Energy Consumption and Air Pollution. Also,...
The conversion to lead free and halogen free materials have raised several new assembly and reliability issues. The reliability concern attaches gradually more importance to the pad cratering on Printed Circuit Boards (PCBs). The cracking happened on the laminate under the solder connect pads, known as pad craters, is the board level reliability issue related to mechanical stresses. We will establish...
With wireless applications flourish like mobile phone, consumer end products must tend to small form factor development. More functions, less dimension, and high integration are future technology trend in chip package development roadmap. Integrated Passive Device (IPD) has these advantages in SiP and 3DIC applications. IPD technology can integrated more passive circuits/components in one IPD die...
In this study, various micro-bump-bonded structures with TCB + NCP processes were evaluated and developed. A commercial available snap-cure NCP material was applied for the joining processes study. Three types of micro bumps, Cu/Ni/Sn2.5Ag, Cu/Sn2.5Ag and Cu/Ni/Au- were fabricated and bonded to achieve joint structures of Cu/Ni/Sn2.5Ag/Ni/Cu, Cu/Ni/Sn2.5Ag/Au/Ni/Cu and Cu/Sn2.5Ag/Au/Ni/Cu. Moreover,...
As the demands for high density 3DIC stacking increase, a fine-pitch chip-to-chip interconnects is becoming imperative. In conventional flip-chip technology, anisotropic conductive film (ACF) has been used in place of solder and underfill for chip attachment to substrates in some applications, because it provides many advantages. Generally speaking, ACF consists of an adhesive polymer matrix with...
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