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The paper explores complex interactions between chemistry, mechanics and thermodynamic parameters involved in the water based PCBA cleaning process. Current complexity of PCB assemblies, together with the needs to clean flux residues with the high grade of polymerization, due to higher soldering temperatures, requires a new approach in design of cleaning systems. A very detailed study of individual...
Dispensing processes are usually set up for specific ranges of viscosities and their related achievable resolution. This fact is closed to an increasing number of limiting parameters depending on the printing resolution. Many parameters of dispensing system are less important and don't have such impact on the final print quality in the case of printing with a resolution worse than approximately 250...
This paper presents the design, processing and packaging of one of the most advanced neural implants to date: a neural implant providing a digital signal out corresponding to the simultaneous recording from 52 locally amplified electronically selectable electrodes anywhere along its 1cm long, 100um wide and only 50um thick implantable shank. For safer device handling during packaging and manipulation,...
Superior properties of nanomaterials were utilized by the authors in new type of polymer compositions, for emerging technology — printed electronics. This is a new trend in production of electronic devices, providing ability to manufacture low-cost and disposable electronic circuits using well-known printing techniques such as screen printing, roll-to-roll and ink-jet. The use of nanostructures and...
Packaging-induced stresses and residual stresses from fabrication can pose a serious threat to the long term functioning of microsystems. Reliability studies on potential failure sources have an impact on MEMS design and support efforts to assure the required performance over the full life cycle. High-resolution x-ray diffraction is a powerful method providing key information on stresses and defects...
Bonding and integration technologies in ultrasound probes are challenging due to space limitations. Flexible substrates, with the benefits of being bendable, small and allows 3D integration, is an excellent choice for signal transferring in such systems. We have chosen to use anisotropic conductive film (ACF) as interconnection technology and the quality and the reliability of a flex-ACF-flex bonding...
The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high-temperature applications. In this study, mixed Ag particle...
Insufficient blood supply to the organs is the major cause of morbidity and mortality worldwide. This condition must be detected early to avoid irreversible loss of function and tissue death as occurs with for instance myocardial infarction, stroke and many other diseases. It has been shown that CO2 tension in tissue is a valid variable for detecting insufficient blood supply in any organ, yet there...
Power electronics for automotive applications has strong demands regarding reliability and cost. Especially the upcoming hybrid cars and fully electrical vehicles need compact and efficient power modules. Conventionally components like IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics and their top contacts are connected by thick Al wires. These ceramic modules are soldered to water-cooled...
The flip chip market is currently experiencing strong growth, at a compound annual rate (CAGR) of 19%, thanks in large part to copper pillar and microbumping metallurgy advances for expanded use in memory, consumer electronics, and mobile phones. Flip chip technology continues to evolve and is playing a large role in 2.5D interposers and 3DICs. Flip chip technology isn't new. First introduced by IBM...
Traditional, all electronic, microwave time domain reflectometry (TDR) is a well established fault isolation technique within the semiconductor industry and can typically localize an open or short fault to within 500μm of the defect. This level of fault localization is not sufficient in advanced IC packages due to the increased complexity and the reduction in physical package size, hence, the ability...
The anodic bonding of low temperature co-fired ceramics (LTCC) for the wafer-level-packaging of MEMS represents a cost efficient and highly reliable packaging method. To enable for a reliable bonding between the LTCC and the Si wafer the ceramic should have a surface roughness below 50–100 nm. With the aim of avoiding the polishing step for realizing a low ceramic surface roughness a newly developed...
3D integration and TSV process require chip thinning. For TSV mid process or TSV last, chips with silicon thicknesses below 200μm or even below 100μm are becoming more and more usual. Due to this silicon thickness decrease, those chips are very sensitive to the deposit layers stress. A precise chip bow management with temperature is so mandatory for these thin chips mounting compatibility. The first...
Power electronics has gained an enormous significance in the European research area: With CO2 reduction as one of the grand challenges in our industrial society, the economy asks for large-scale energy harvesting from natural regenerative resources on one hand, and for energy efficient electronic devices on the other. Although power electronics systems have their own challenges, there is a general...
Packaging of Micro Electro Mechanical Systems (MEMS) requires technical challenges to be solved and overcome when stringent vacuum and hermetic sealing is required. This is typical for a wide class of sensors, such as inertial sensors, IR micro-bolometers, MEMS atomic clocks, where such conditions need to be achieved to guaranty the performance stability during the devices lifetime. Vacuum hermetic...
This paper investigates the RF properties of 5 μm diameter/50 μm depth through-silicon vias (TSVs) built in CMOS 65nm technology. An equivalent lump model of the TSVs was developed based on 3D full-wave electromagnetic simulations and was validated by RF measurements. Based on the validated TSV model, the crosstalk among the TSVs was addressed as a function of distance and frequency. An equivalent...
Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material has been developed for the 60 μm pitch SoP using screen printing process. Solder bumping material which is composed of the Sn3.0Ag0.5Cu (SAC305) solder powder and polymer resin is a paste material to perform the fine pitch SoP in place of the electroplating process...
Saving time and money is a key and nowadays major issue in all fields and structures (whatever industry or lab). However, component reliability should not suffer from shorter development time ! An emerging approach to decrease model development time and errors is to use real measurements data to implement the models. For several types of application (electronic, power, adhesive), a methodology was...
The need to increase performance in limited space is driving packaging solutions to use the third dimension. This trend is most concrete with a package-on-package (PoP) architecture. PoP is a configuration where packaged integrated circuits (IC) are placed directly on top of each other. The interconnects are between the top package and the bottom package and the bottom package and the printed circuit...
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