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Mobile and IoT(Internet of Things) applications require semiconductor packages with increasingly smaller form factor and higher performance, but still at low cost. This paper introduces various laminate based package substrates developed to serve these applications: ETS(Embedded Trace Substrate); ETPS(Embedded Trace and Passive Substrate); cavity substrate; high stiffness, low warpage thin substrate(80μm);...
The filling process of Through-Silicon Via (TSV) based on printed silver using the Aerosol Jet™ method is presented and discussed. TSVs with different diameters as via-last process in 18 μm ultra-thin ChipFilm™ dies, including a self-aligned etching process and their passivation are demonstrated. Daisy chain test structures on top of ChipFilm™ dies and on the bottom wafer are used for demonstration...
We realized λ/4-shifted membrane DFB lasers for an ultralow threshold current operation. A threshold current of 280 μA was obtained for the cavity length of 30 μm under room-temperature continuous-wave condition.
For producing a variety of flexible MEMS sensors, we previously developed a process that uses a Cu On Polyimide (COP) substrate as a starting material and sacrificial Cu etching to produce a cavity and electrical feed-through structures on the substrate [1]. In the current study, we introduced a vacuum cavity realizing high thermal isolation in a flexible thermal sensor, for the first time. Parylene...
Etching post-processes are usually done with systems based on MEMS structures compatible with CMOS technology like micro hotplates membranes used in MEMS gas sensors. Silicon anisotsropic etch steps follows fabrication of the integrated circuit in a silicon foundry for the release of the membrane but care should be taken to avoid damage to other layers used for integrated circuit fabrication, as aluminum...
Dry etching process of InP is developed using inductively coupled plasma (ICP) with halogen and hydrocarbon based gas mixture. This recipe is optimized for deep groove etching requiring a high anisotropy and smooth surface morphology in integrated photonic device fabrication. A laser with good performance is fabricated using the etched groove as a partial reflector.
A new additive ultra-thin chip fabrication process is presented, utilizing an array of vertical anchors that mechanically connect silicon membrane chips to a standard silicon wafer. The process is demonstrated down to 8 μm silicon chip thickness, with a chip thickness control better than ±0.2 μm and a surface topography with average roughness <; 7 nm. Such pre-processed wafers can be used for CMOS...
In this paper, we present the design and fabrication of 3-D silicon micro-arrays consisting of a wide range of isotropically-etched cavities and describe a model based upon their shape to investigate the influence of the etched features on cell trapping within cavities. We performed our study using non-invasive (MCF10A) and invasive (MDA-MB-231) breast cells separately and in a co-culture system....
Ultra-thin chip technology is identified as an enabler for overcoming bottlenecks in microelectronics, such as 3D integration, and for leading to new applications, such as hybrid, flexible system-in-foil (SiF). This, however, calls for new techniques in fabricating very thin wafers or chips, in applying them to device integration processes and in assembly and packaging. The application to SiF requires...
Plastic electronics, thin-film-transistors on foil and ultra-thin chips on foil are technologies currently pursued to support the strongly emerging market for flexible electronics. Ultra-thin CMOS chips in such systems will provide solutions whenever high circuit performance and/or complexity are required. Ultra-thin Si chips (6 to 20 mum) are fabricated by using a recently introduced technology based...
This research describes the truncated micro-pyramid reflective cavity for light emitting diodes (LEDs) packaging and increasing LEDs' heat dissipation. Research went through different microstructure profiles related to thermal effect in LEDs' packaging. Microstructures based on the silicon bulk micromachining provide unique truncated micro-pyramid reflective cavity geometry for LEDs assembly. Etching...
We present a thermal flow sensor that is suitable for measuring nasal respiration. To fix the flow sensor inside the nasal passage, we integrated it onto a stent structure, which is normally used as a medical device. The sensor was monolithically integrated on the Ti substrate by applying photolithography and wet etching processes. The developed fabrication has advantage that it is able to fabricate...
Surface-normal ultra-compact narrowband optical filters and broadband reflectors can all be realized via Fano resonances on patterned single layer silicon nanomembranes (SiNM) layers on SOI. Recently, we reported Fano filters transferred onto glass or flexible polyethylene terephthalate (PET) substrates, employing a low temperature wet-transfer process. Here we report demonstration of broadband reflectors...
In the domain of manufacturing and packaging of micro-system, the Pyrex7740 glass is a widely-used material since its coefficient of thermal expansion is similar to that of silicon, and its good optical performance for biosensors and optical sensors. But the use of Pyrex7740 glass is limited for its isotropic etching characteristic of tradition micro-machining. In this paper, we present a new process...
The power consumption and the matching will be the principal issues at the 32 nm node and below. In this context, Ultra-Thin Body devices are extensively studied for the end-of-roadmap CMOS. In this paper we present the SON technology, leading to the simple fabrication of sustained mono-Si nano-membranes over an empty tunnel, and discuss on the application of this process to build-up electronic devices...
Summary form only given. There is considerable interest in the study of light emission from optical cavities whose dimensions are of the order of a wavelength in all three dimensions. Most work has been carried out on etched structures. We propose and demonstrate a novel method for the fabrication of GaAs semiconductor optical microstructures by self-organization during molecular beam epitaxial growth...
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