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The development of the density of integrated contacts for the Microelectronics has risen over the last years, based upon the higher integrity level of sensors and signals. Thus, the width and the spaces between the contacting lines decreased significantly from 500μm down <100μm and should be less than 30 μm within the next years. Those lines can be realized by screen or stencil printing techniques...
Lead-free solders around the Sn-Ag-Cu eutectic point offer many choices of parameters critical to assembly, such as melting point or range, thermal expansion coefficient, ductility or hardness. Published results with such systems are difficult to compare, as differences in geometry (solder volume, aspect ratio bump height to bump base, maximum bump width) as well as test conditions affect the results...
Shear test has become an established method to assess quality and reliability of solder bump assembly techniques, also for reduced bump size. Several authors have found that median bump shear strength does not scale with the area of the shear surface, but only with its square root. This work shows that bump shear test does not progress along the theory developed for bolt shear, but follows a cutting...
This paper presents Thick Printed Copper (TPC) and Celcion® as thick film technologies for a broad spectrum of industrial applications, which feature a strongly improved reliability combined with a high degree of design freedom compared to the incumbent technologies. The advantages of TPC over Direct Bonded Copper (DBC) substrates will be demonstrated by thermal shock test results and a demonstration...
Compared to the COB process (wire bonding) the flip-chip process is significantly more intolerant to pre-existing mechanical die damage. This can be caused by the mechanical pretreatment of the dies, the thinning and sawing of the wafers, but above all by the cutting out of the dies during the assembly process. The pre-existing damage constitutes a reliability risk, as thermal shock testing demonstrates...
The unique requirements of entry into new markets (automotive, wearable, IoT) is forcing companies to implement sophisticated package structures to realize the latest product platforms that meet aggressive schedule and market requirements. To address these market challenges, engineering teams need to evolve from working in silos and working within a disconnected process, to a new or advanced methodologies...
This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used. Moreover, virtual...
In this paper, conventional PVD method with fine-tuned process parameters is used to deposit barrier/seed layers in our 10×100μmTSV interposer process. High power and low power RF bias are alternately applied to the substrate in order to get more conformal barrier/seed layers on the recessed features of TSVs. The high power RF bias has been found to offer many benefits such as enhancing nucleation...
In the paper we consider a multi-layer ceramic capacitor (MLCC) of size 1206 with X7R dielectric. The main goal of this study is to analyze the behavior of micro cracks in the ceramic such as to determine if they are able to propagate and if so to determine the preferred direction of propagation. A four-point bending setup of soldered MLCC has been used and a finite element model of the soldered capacitor...
With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly...
Today's packaging standard for consumer MEMS sensors are plastic mold packages of the LGA or QFN type. Multiple chips are placed on a substrate or leadframe, electrically connected by wire bonds and protected by overmolding the sensitive devices. While being a flexible and very effective packaging technology it contributes significantly to the overall sensor dimensions in x-, y- and z-direction. The...
Innovative medical products generate new challenges for the electronics packaging. The solder joining on heat-sensitive and copper-cladded polymer substrate is the urgent activity. In this paper preliminary studies will be presented for the ignition behavior of a reactive multilayer foil, in order to ensure the formation of a solder joint. Here, a ignition mechanism is selected and evaluated. The...
The structural performance of electronic devices depends immensely on the standoff height of the components used to assemble them. The component standoff height (CSH) of electronic assemblies can be varied either by changing the settings of the reflow profile parameters or by varying the diameter of bond pad on the printed circuit board (PCB). The continued desire by electronic manufacturing industries...
Thermal simulations of power LED's packaging were performed. Results focus on design proposals for Rth and thermal management improvements, favoring the use of LEDs in automotive lighting. As automotive applications require ever increasing power from LEDs, thermal management is still one major issue for lighting systems designers. Ambient temperature in the front lighting system can get as high as...
Capillary type underfill still dominates for the underfill applied to mass-produced flip chips and is dispensed after chip attachment process. Also nonconductive paste (NCP), applied before chip attachment, has been introduced for fine pitch applications. Thermal compression bonding (TCB) is adapted for this process. These pre-applied type underfills have advantages such as no need to have space to...
A major limitation in high-power three-dimensional chip stacks is the heat removal of dissipated power. To this end, highly thermally conductive intra-stack bondlines are required. Percolating thermal underfills (PTUs), where densely packed micron-sized dielectric particles fill the open space resulting from the electrical interconnects between individual chips, are expected to improve the effective...
Recently many issues came up when using conventional dicing methods. Such conventional methods are mechanical sawing (blade dicing) or laser dicing or stealth dicing. Relevant applications are thin wafers, brittle materials and wafer singulation for very small devices or LED or discretes. Plasma dicing is a recommended method to overcome many challenges of wafer separation. Damage free, water free,...
Removal of heat is critical for the efficient and safe operation of many types of semiconductor device. Substrates like aluminium nitride are used in high-end devices and semiconductor packaging due to its excellent thermal and dielectric properties. The problem is the cost can be prohibitive for many devices. A new development offers a cost-effective alternative. By using an electro-chemical process...
Transparent heaters were spray-coated directly on a 1600 cm2 glass substrate used as a windowpane. The coating process was made in regular production conditions without the use of clean room or high temperature processing. Spray coating paints contained mixture of multiwalled carbon nanotubes and graphene platelets, added as a functional phase to achieve desired electrical and optical properties....
For high frequency applications, the electrical circuit performance is strongly related to the quality and loss characteristics of the passivation layer. In this work, we present the comparison of high frequency performances of different passivation materials for in a frequency range up to 110 GHz. The evaluation of the materials is based on measurement of coplanar transmission lines on the redistribution...
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