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Lead-free solders around the Sn-Ag-Cu eutectic point offer many choices of parameters critical to assembly, such as melting point or range, thermal expansion coefficient, ductility or hardness. Published results with such systems are difficult to compare, as differences in geometry (solder volume, aspect ratio bump height to bump base, maximum bump width) as well as test conditions affect the results...
This paper presents Thick Printed Copper (TPC) and Celcion® as thick film technologies for a broad spectrum of industrial applications, which feature a strongly improved reliability combined with a high degree of design freedom compared to the incumbent technologies. The advantages of TPC over Direct Bonded Copper (DBC) substrates will be demonstrated by thermal shock test results and a demonstration...
Compared to the COB process (wire bonding) the flip-chip process is significantly more intolerant to pre-existing mechanical die damage. This can be caused by the mechanical pretreatment of the dies, the thinning and sawing of the wafers, but above all by the cutting out of the dies during the assembly process. The pre-existing damage constitutes a reliability risk, as thermal shock testing demonstrates...
The stress relaxation of materials used for e-textiles is investigated. Polymer yarns without and with metallization, and metal wires show time-dependent flow kinetics. Electric contacts in weaved structures are sensitive to shear fatigue. Local welded zones crack due to shear deformation. The experiments yield a basis for the reliability prediction of e-textiles.
Shear test has become an established method to assess quality and reliability of solder bump assembly techniques, also for reduced bump size. Several authors have found that median bump shear strength does not scale with the area of the shear surface, but only with its square root. This work shows that bump shear test does not progress along the theory developed for bolt shear, but follows a cutting...
The development of the density of integrated contacts for the Microelectronics has risen over the last years, based upon the higher integrity level of sensors and signals. Thus, the width and the spaces between the contacting lines decreased significantly from 500μm down <100μm and should be less than 30 μm within the next years. Those lines can be realized by screen or stencil printing techniques...
The unique requirements of entry into new markets (automotive, wearable, IoT) is forcing companies to implement sophisticated package structures to realize the latest product platforms that meet aggressive schedule and market requirements. To address these market challenges, engineering teams need to evolve from working in silos and working within a disconnected process, to a new or advanced methodologies...
This paper is dealing with the influence of the electronic board attachment on its mechanical properties during the vibration load. Different number of screws and their position is investigated through the simulation in Ansys Workbench program. Setup is also verified by the measurement on the vibration table, where the sinus sweep from 10Hz to 2kHz with the 0,3g amplitude will be used. Moreover, virtual...
Isotropic conductive paste (ICP) has been continuously developed to get a good electrical performance for the semiconductor packaging applications. The conductivity of the ICP material is simply determined based on the contact between adjacent metal particles in a polymer matrix. Therefore, the mechanical shock applied on the semiconductor package can be a bad point of the adhesive strength between...
This work describes an optimization tool-based design method for a Current Mode Logic CML divide-by-2 circuit embedded in a frequency synthesizer for RFID-protocol based transceiver implementation. Designed for driving multiple loads with asymmetric input capacitance to be driven at system level (through the PLL output frequency generation), the circuit was optimized for operation at lowest power...
In this paper, conventional PVD method with fine-tuned process parameters is used to deposit barrier/seed layers in our 10×100μmTSV interposer process. High power and low power RF bias are alternately applied to the substrate in order to get more conformal barrier/seed layers on the recessed features of TSVs. The high power RF bias has been found to offer many benefits such as enhancing nucleation...
In the paper we consider a multi-layer ceramic capacitor (MLCC) of size 1206 with X7R dielectric. The main goal of this study is to analyze the behavior of micro cracks in the ceramic such as to determine if they are able to propagate and if so to determine the preferred direction of propagation. A four-point bending setup of soldered MLCC has been used and a finite element model of the soldered capacitor...
This paper presents design, setup and test of a heterogeneous antenna tuner module and its characterization by stress measurements. Key features provided for this integration platform are a small module size in combination with a low module height, a good RF performance, good heat dissipation capabilities, high electrical and thermo-mechanical reliability also supporting the low pressure encapsulation...
The sol gel process is an interesting method to functionalize different surfaces. It enables the deposition of non-metallic inorganic layers from the liquid phase. The sol is prepared from precursors, typically based on metal alkoxides. It is applied on the surface, where by dip coating, spray coating or spin coating can be used. The liquid sol flows into hollows and thus smooth the coarse ceramic...
The growing demand for highly reliable and compact power electronic modules capable of operating at high switching frequencies and temperatures require optimized interconnection and packaging technologies. This holds true also for conventional electronics for usage at elevated temperatures, which allows additional options for miniaturization and high system integration without complicated cooling...
Because of the need for electronics use at temperatures beyond 150°C, new high temperature interconnection technologies emerge, like silver sintering and copper wire bonding. In the project PROPOWER inverter modules with IGBTs and diodes mounted on DBC substrates were investigated as a prototype. Analyses were made to study the effects of the new interconnect technologies on fatigue failure. It is...
With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly...
Today's packaging standard for consumer MEMS sensors are plastic mold packages of the LGA or QFN type. Multiple chips are placed on a substrate or leadframe, electrically connected by wire bonds and protected by overmolding the sensitive devices. While being a flexible and very effective packaging technology it contributes significantly to the overall sensor dimensions in x-, y- and z-direction. The...
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