Search results for: Vladimir Cherman
Microelectronics Reliability > 2018 > 87 > C > 97-105
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 2 > 221 - 228
IEEE Design & Test > 2016 > 33 > 3 > 37 - 45
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 4 > 653 - 662
TMS2015 Supplemental Proceedings > Pb‐Free Solders and Emerging Interconnect and Packaging > 1353 - 1360
2014 IEEE International Reliability Physics Symposium > 2F.2.1 - 2F.2.6
Microelectronic Engineering > 2013 > 106 > Complete > 155-159
Sensors & Actuators: A. Physical > 2013 > 189 > Complete > 218-232
2012 IEEE International Reliability Physics Symposium (IRPS) > 3E.4.1 - 3E.4.6
IEEE Transactions on Semiconductor Manufacturing > 2012 > 25 > 3 > 365 - 371
Microelectronic Engineering > 2011 > 88 > 8 > 1753-1756