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Integrated circuit (IC) packages can delaminate under thermal cyclic loading because of elastic properties mismatch between the components. On the other hand, delamination has no pattern which points out the effect of variations of the design parameters on the response. Hence, a robustness estimation should be done to have more stable IC packages which show no important variations in the response...
This paper presents the modelling of a Micro-Opto-Mechanical Pressure Sensor (MOMPS) manufactured in a SiN integrated photonic platform. Implemented using a single wavelength Mach Zehnder Interferometer (MZI), it relies on a single readout detector that could be integrated directly on CMOS. Current photonic processes exhibit high residual stresses in the sensitive membrane. In this paper we will focus...
The microstructure of lead-free solder joints often consists of only one or a few randomly oriented tin grains as a result of a large degree of undercooling during solidification. Due to the severe anisotropy of single crystal Sn and the random nature of the microstructure, the stress state and microstructural evolution of each joint will be unique.
This paper presents the scope of applicability of Dual-Phase-Lag model in modern electronic structures. Moreover, the investigation of obligatory application of this model, instead of the classical approach based on Fourier-Kirchhoff model, to heat transfer modeling is included. Furthermore, the modified Fourier-Kirchhoff thermal model, containing the special time lag parameter, is also taken into...
Modeling the electric field in a matrix of micro-mirrors is presented as the first application of the MEMSALab software package. The latter is dedicated to semi-automated derivation of multiscale models by asymptotic methods and will complement simulation software as finite element software. It is designed according to a principle of reusability which is called the extension-combination method developed...
A new type of novel high voltage IGBT module package with a 140mm×100mm footprint half-bridge has been developed. The module aims to provide the market a new type of high power density, high reliability standardised package. The module is scalable and suitable for multi-module parallel connection without degradation, is a low inductance design for both the internal structure and external connection,...
Three-dimensional (3D) electronic systems enable higher integration densities compared to their 2D counterparts, a gain required to meet the demands of future exa-scale computing, cloud computing, big data systems, cognitive computing, mobile devices and other emerging technologies. Through-silicon vias (TSVs) open a pathway to integrate electrical connections for signaling and power delivery through...
Recently, with the increasing requirements on guaranteeing the color uniformity and improving the luminous efficacy and manufacturing efficiency, a wafer level chip scale packaging (WLCSP) technology has been developed by thermally impressing a thin multiple phosphor film on a LED wafer, then being segmented into individual LED chips. In this paper, a high power white LED Chip-on-Board (COB) module...
Advanced driver assistance systems such as Forward Collision Warning or Lane Departure Warning on automobiles rely heavily on a vision-based system. One such system is a monocular camera that is mounted inside the cabin on the center of the windshield. This module has a temperature sensitive FPGA and Image Sensor. The module sees extreme temperature environments due to high solar radiation in the...
A novel method based on the analytical multi-physics simulation to predict the lifetime for LED systems is presented in this paper. LED is a typical multidisciplinary system that transfers electrical input into photonic output, and lifetime prediction is a must for new electronic device before releasing to market. The lifetime feature of LED systems is closely connected to the power, thermal, and...
Tarnishing of the reflective silver layer in LED packages is an important failure mechanism, leading to both a decrease in luminous flux by up to 75% and a change in color spectrum.
Silicon based pressure sensors often take advantage of piezo-resistive gages which are normally embedded by multiple silicon oxide and silicon nitride layers where gold lines form a Wheatstone bridge. As a result of manufacturing - stepwise deposition of multiple layers - significant layer residual stresses occur in the GPa range in tension and compression. But also anodic bonding of the silicon MEMS...
The study focused on the onset of plastic flow in various copper raw materials. The tested copper sheets varied by the way they were manufactured (e.g. electroplated, cold rolled), by post treatments (e.g. chromate coating) or by pre ageing. Tests were conducted at different temperatures (25°C, 60°C, 100°C, 150°C). The results show that the onset of plastic flow depends strongly on the manufacturing...
The aim of the study is to carrying out a series of experimental reliability tests for lead solder alloy Sn63Pb37 regarding to the so-called model of damage accumulation. In spite of Sn63Pb37 is prohibited in mostly cases by RoHS directive it is still used in lots of electronic devices which have influence on human life safety e.g. life-support machines, airplanes etc. That's why authors decided to...
The ability of Through Crackstop Via (TCV) to prevent cracks from propagation is compared to conventional crackstop using a novel systematic simulation methodology. The design of TCV is, then, optimized by varying the angle between the metal layers as well as the TCV width. The larger angle and width result in a better TCV. The improvement in the TCV saturates at a specific TCV width.
With the continuous development of two dimension materials technology, found that can be used in more and more application fields. The application of new sensor based on new 2D materials with higher precision has sparked an upsurge research. Here, we study by first-principles calculations the adsorption of NO and H2S gas molecules on a monolayer arsenic-phosphorus. The simulation results testify that...
This paper is focused on the thermally-induced thermo-mechanical load in interconnections of electronic products, which are necessary to connect an electronic component on substrate material (such as Printed Circuit Board). In order to improve of the material selection, the Fraunhofer IKTS has developed a measurement setup enabling a cost-efficient material characterization in terms of mechanical...
3D-Printing technology, or additive manufacturing, is seeing increased interest in the electronic packaging community as it has the potential to enable cost-effective, potentially high-throughput and high degree of design customisation. At the same time there are a number of challenges related to quality, performance and reliability of the fabricated products. Technological advances and other capabilities...
An electronic test module is designed in order to monitor field failures of board assembly interconnections while simultaneously measuring the environmental loading conditions. The test module is built-in on the ceiling of a daily driving bus. During operation, when the engine is on, daisy chain interconnections as well as temperature and accelerometer sensors are measured continuously. The purpose...
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