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The mechanical strength of non-metalized silicon joints made with low-temperature and low-pressure silver nanoparticles sintering was discussed. Material composition, as far as sintering process parameters impact on mechanical strength was presented in the paper. The X-Ray, X-Ray computed tomography, optical microscope images for layer surface and cross-sections were considered.
Downsizing and increase of working speed of the electronic circuits bring out generating of large amount of heat during operating. The thermal interface materials (TIMs) are one of the best choice to increase the efficiency of heat transfer from the heat source to the heat spreader. Moreover, micro- and nano-sized metallic compounds of thermal interface materials which aim is to increase the thermal...
The aim of this work was assessment of application diffusion soldering in die attachment for the electronic devices operating at temperatures above 300 °C. Assembly process was based on the intermetallic compound formation in Sn, Cu and Ag systems at temperatures above Sn melting point. New-created compounds should be thermally stable in high temperatures. The influence of the following parameters:...
The miniaturization trend of electronic devices and simultaneous increase of packaging density and clock frequency can generate the large amount of heat that appears during operation of such devices. The thermal interface materials (TIMs) are currently one of the most important materials used in electronic packaging, because their role is to reduce the thermal contact resistance between the heat source...
Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the...
Nowadays a passive cooling based on efficient reliable thermal interfaces begins to play a dominant role in modern consumer electronics. The devices become smaller, thinner and more powerful while semiconductors become the source of higher flux heat density. In order to reduce thermal resistance between a semiconductor junction and a heat spreader, semiconductor structures remain unpackaged i.e. flip-chip...
Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of such materials is high thermal conductivity of silver, ease of application in integrated circuit production and relatively low temperature of sintering...
The work in this article was aimed at the assessment of heat transfer through the system consists of stacked copper substrate, thermal interface material (TIM) and silicon die. Two types of TIMs studied within this paper were based on nano- and micro-sized particles of silver in various content rate of particles. The connection between chip and substrate made by TIM was achieved in sintering process...
Thermal Interface Materials are used in microelectronic packaging for reducing so called thermal resistance between heat source and heat sink. They are commonly used, often in form of thermally conductive adhesives, as an attaching materials for fixing silicon chips in the integrated circuits. Therefore, beside the thermal properties, a good mechanical strength of TIMs is required. Within this paper...
Continuous miniaturization of semiconductor devices enables integration in packages on increasingly smaller surfaces. Increasing power and minimization of dimensions results in diametrical increase of thermal flux density. Current works are focused on high performance TIMs (Thermal Interface materials). The main role of such TIMs is efficient dissipation of heat from electronic device to the surface...
In this paper preliminary investigations of electrical properties of new Thermal Interface Materials (TIMs') are presented and discussed. Investigated TIMs are based on mixture of silver flakes and silver nano-particles (nano-Ag) with high content of silver (more than 90% weight). After curing and sintering of such materials, as a result, a bulk, homogenous silver layer with good electrical and mechanical...
This paper is aimed to the evaluation of interfacial thermal resistance between carbon nanotube and crystal of silicon by using molecular dynamics simulation. The calculations were executed by implemented algorithm for enforcing the heat flow in the model (PERL script language) in Forcite module of Materials Studio software (Accelrys, Software Inc.). Two models of the interface between carbon nanotube...
This paper describes first attempt to coarse-grained molecular dynamics study of heat transfer in thermal interface materials. All calculations and most of preparation steps are conducted using customized PERL scripts for Materials Studio 6.0. The first part introduces the developed approach to molecular modeling, which allows the study of the properties of thermal interface materials which provide...
In this paper study on algorithms for evaluation the thermal conductivity of nanomaterials by using molecular dynamics technique was presented. First one is based on algorithm proposed by Ikeshoji and Hafskjold, the second one is developed by authors. As a reference material the boron nitride in hexagonal form was taken into consideration. The heat transfer was studied in-plane of BN layers as well...
The continuous progress in miniaturization and integration of semiconductor devices have led to increasing heat generated from unit volume in the chip. Consequently, more efficient thermal management on chip and package level is required because the reliability of electronic equipment strongly decreasing with rising the temperature of work. To improve the heat dissipation from chip to package as well...
The ink-jet printing is a noncontact technique for production electrically conductive structures, also on flexible substrates. The greatest challenge is the conductive material for printing — the ink, because it influences the parameters of printed structures. The structures are nonconductive just after the printing and to obtain good electrical conductivity, they need an additional energy, mainly...
In this paper the influence of photonic sintering process parameters on the resistance of ink-jet printed structures were examined. The sintering process was performed by delivering to samples an energy in the form of light pulses (1200 J per pulse). There was specified the factors which would have the most significant influence on the results (resistance of sintered structure) such as: distance between...
Conductive inks market for printable electronic grows rapidly last years. The main disadvantage of using inks filled with nano-Ag particles is sintering process, which often requires relatively high temperatures (over 180°C). This forces the use of expensive, high temperature substrates, for example polyimide foils. In some applications it is unacceptable to subject substrate to high temperature,...
Miniaturization trend in modern electronics needs high density interconnect technologies and new materials, like elastic foils as substrates. Packaging on both external or even internal layers of such substrates needs electrically connections between layers. It is usually done by holes filled by electrically conductive materials and named as microvias. In the paper the ink-jet printing technology...
In this paper the manufacture process influence on thermal conductivity of polymer composites used as the Thermal Interface Material (TIM) is presented. To evaluate the influence of the manufacture factors the design of the experiment technique (DoE) and Analysis Of Variance for the results (ANOVA) were used. From the experiment results one import5ant factor and one important interaction have been...
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