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The miniaturization trend of electronic devices and simultaneous increase of packaging density and clock frequency can generate the large amount of heat that appears during operation of such devices. The thermal interface materials (TIMs) are currently one of the most important materials used in electronic packaging, because their role is to reduce the thermal contact resistance between the heat source...
Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the...
Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of such materials is high thermal conductivity of silver, ease of application in integrated circuit production and relatively low temperature of sintering...
The work in this article was aimed at the assessment of heat transfer through the system consists of stacked copper substrate, thermal interface material (TIM) and silicon die. Two types of TIMs studied within this paper were based on nano- and micro-sized particles of silver in various content rate of particles. The connection between chip and substrate made by TIM was achieved in sintering process...
The paper deals with the thermal properties of Ag sintered layer used as interconnect material for SiC die assembly to DBC substrate. In our investigation an IR camera were used for measurement of thermal properties of Ag sintered layers. The changes of thermal conductivity were measured in temperature range from 69°C up to 221°C. The thermal conductivity of Ag sintered layers thickness 15 μm, made...
This paper is aimed to the evaluation of interfacial thermal resistance between carbon nanotube and crystal of silicon by using molecular dynamics simulation. The calculations were executed by implemented algorithm for enforcing the heat flow in the model (PERL script language) in Forcite module of Materials Studio software (Accelrys, Software Inc.). Two models of the interface between carbon nanotube...
This paper describes first attempt to coarse-grained molecular dynamics study of heat transfer in thermal interface materials. All calculations and most of preparation steps are conducted using customized PERL scripts for Materials Studio 6.0. The first part introduces the developed approach to molecular modeling, which allows the study of the properties of thermal interface materials which provide...
In this paper study on algorithms for evaluation the thermal conductivity of nanomaterials by using molecular dynamics technique was presented. First one is based on algorithm proposed by Ikeshoji and Hafskjold, the second one is developed by authors. As a reference material the boron nitride in hexagonal form was taken into consideration. The heat transfer was studied in-plane of BN layers as well...
The continuous progress in miniaturization and integration of semiconductor devices have led to increasing heat generated from unit volume in the chip. Consequently, more efficient thermal management on chip and package level is required because the reliability of electronic equipment strongly decreasing with rising the temperature of work. To improve the heat dissipation from chip to package as well...
In this paper the influence of photonic sintering process parameters on the resistance of ink-jet printed structures were examined. The sintering process was performed by delivering to samples an energy in the form of light pulses (1200 J per pulse). There was specified the factors which would have the most significant influence on the results (resistance of sintered structure) such as: distance between...
In this paper the manufacture process influence on thermal conductivity of polymer composites used as the Thermal Interface Material (TIM) is presented. To evaluate the influence of the manufacture factors the design of the experiment technique (DoE) and Analysis Of Variance for the results (ANOVA) were used. From the experiment results one import5ant factor and one important interaction have been...
The electronic microstructures performed by ink-jet printing nanosilver-contained inks are nonconductive just after the printing. To obtain good electrical conductivity they require the additional energy, mostly supplied during a heating process in relatively high temperature (above 200 °C). Such high temperature is not convinient for the most polymers which would play a role of flexible substrates...
Combining conductive micro and nanofillers is a new way to improve electrical, thermal and mechanical properties of polymer composites for electronic packaging. Micrometric silver flakes and nanometric carbon nanotubes (CNT) exhibit high electrical and thermal conductivity. Moreover CNT improve strength, stiffness and fracture toughness of the polymer matrix. A new type of hybrid conductive adhesive...
Carbon nanotubes (CNT) consist of rolled graphene sheets with common center. Direct introducing of CNT to the polymer is very difficult because of they have the very high specific surface. To introduce CNT to polymer matrix requires their dispersion in a liquid carrier. To improve dispersion of CNT in fluids new method with combine two phenomena, dielectrophoresis and megasonification, was describe.
In the following paper the measurement method of thermal conductivity is described. These method was especially designed for measuring the thermal conductivity of the thermally conductive adhesives. The principal information about the experimental setup, mathematical model of experiment and the change of its uncertainty (calculated using type B method presented in ISO Guide for measurements) depended...
Since the late eighties of the last century, digital ink-jet technology has been widely explored by the electronic industry in developing new manufacturing processes. Nowadays, ink-jet printing technology is increasingly being used to create the electrically conductive structures on flexible substrates. Ink for printing conductive microstructures is typically based on noble metals of nano-sized dimensions...
In the current paper the influence of diameter of finite-length zig-zag single-walled carbon nanotube (SWNT) on its thermal conductivity at room temperature in ballistic regime was described. The fourteen types of SWNT with various chrality from (7,0) to (20,0) and with constant length (213 nm) were investigated. To calculate the thermal conductivity the non-equilibrium molecular dynamics technique...
Current paper focuses on the influence of carbon nanotube (CNT) length on its thermal conductivity. The powerful technique which is molecular modeling was used. The non-equilibrium molecular dynamics was implemented in commercially available software. The eight single-walled carbon nanotubes from 50 nm to 400 nm was investigated. The obtained results show the trend of increasing thermal conductivity...
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