The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Downsizing and increase of working speed of the electronic circuits bring out generating of large amount of heat during operating. The thermal interface materials (TIMs) are one of the best choice to increase the efficiency of heat transfer from the heat source to the heat spreader. Moreover, micro- and nano-sized metallic compounds of thermal interface materials which aim is to increase the thermal...
The miniaturization trend of electronic devices and simultaneous increase of packaging density and clock frequency can generate the large amount of heat that appears during operation of such devices. The thermal interface materials (TIMs) are currently one of the most important materials used in electronic packaging, because their role is to reduce the thermal contact resistance between the heat source...
Indium is often used as a solder material which also plays a role of thermal interface e.g. in power LED systems. Indium and copper forms the intermetallic compounds. The growth rate constant at 400 K between copper and indium by the molecular dynamics simulations, as well as, experimentally was investigated. The results shown that the growth of the intermetallic compound in both cases follows the...
Nowadays a passive cooling based on efficient reliable thermal interfaces begins to play a dominant role in modern consumer electronics. The devices become smaller, thinner and more powerful while semiconductors become the source of higher flux heat density. In order to reduce thermal resistance between a semiconductor junction and a heat spreader, semiconductor structures remain unpackaged i.e. flip-chip...
Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of such materials is high thermal conductivity of silver, ease of application in integrated circuit production and relatively low temperature of sintering...
The work in this article was aimed at the assessment of heat transfer through the system consists of stacked copper substrate, thermal interface material (TIM) and silicon die. Two types of TIMs studied within this paper were based on nano- and micro-sized particles of silver in various content rate of particles. The connection between chip and substrate made by TIM was achieved in sintering process...
Thermal Interface Materials are used in microelectronic packaging for reducing so called thermal resistance between heat source and heat sink. They are commonly used, often in form of thermally conductive adhesives, as an attaching materials for fixing silicon chips in the integrated circuits. Therefore, beside the thermal properties, a good mechanical strength of TIMs is required. Within this paper...
In this paper preliminary investigations of electrical properties of new Thermal Interface Materials (TIMs') are presented and discussed. Investigated TIMs are based on mixture of silver flakes and silver nano-particles (nano-Ag) with high content of silver (more than 90% weight). After curing and sintering of such materials, as a result, a bulk, homogenous silver layer with good electrical and mechanical...
The continuous progress in miniaturization and integration of semiconductor devices have led to increasing heat generated from unit volume in the chip. Consequently, more efficient thermal management on chip and package level is required because the reliability of electronic equipment strongly decreasing with rising the temperature of work. To improve the heat dissipation from chip to package as well...
Combining conductive micro and nanofillers is a new way to improve electrical, thermal and mechanical properties of polymer composites for electronic packaging. Micrometric silver flakes and nanometric carbon nanotubes (CNT) exhibit high electrical and thermal conductivity. Moreover CNT improve strength, stiffness and fracture toughness of the polymer matrix. A new type of hybrid conductive adhesive...
The results of study focused on reliability of SnAgCu/ImSn (1206 and 0805 SMD) solder joints subjected to vibration in various but constant temperature (−40 and +130) will be presented. The results will be also compared with the results of author's previous reliability tests focused on reliability of SnAgCu solder joints subjected to vibration combined with temperature cycles. Time to failure will...
The essence of accelerated reliability test is to accelerate degradation process of tested object and the assessment of its reliability in test and field conditions. Acceleration factor is a unitless parameter that relates a life time of objects at an accelerated stress level to the life time at the use stress level. Acceleration factor of a single loading reliability tests can be calculated on the...
Mechanical resistance of a solder joint to vibrations and thermal cycling strongly depends on its structure. Defects such as cracks, empty spaces, voids, non-uniform layers of intermetallic compounds (IMCs) can decrease mechanical strength of a solder joint significantly. Constitution of IMC layers depends on joined materials. Formation of an IMC layer can go on after a soldering process. Storage...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.