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The mechanical strength of non-metalized silicon joints made with low-temperature and low-pressure silver nanoparticles sintering was discussed. Material composition, as far as sintering process parameters impact on mechanical strength was presented in the paper. The X-Ray, X-Ray computed tomography, optical microscope images for layer surface and cross-sections were considered.
Downsizing and increase of working speed of the electronic circuits bring out generating of large amount of heat during operating. The thermal interface materials (TIMs) are one of the best choice to increase the efficiency of heat transfer from the heat source to the heat spreader. Moreover, micro- and nano-sized metallic compounds of thermal interface materials which aim is to increase the thermal...
The miniaturization trend of electronic devices and simultaneous increase of packaging density and clock frequency can generate the large amount of heat that appears during operation of such devices. The thermal interface materials (TIMs) are currently one of the most important materials used in electronic packaging, because their role is to reduce the thermal contact resistance between the heat source...
Nowadays a passive cooling based on efficient reliable thermal interfaces begins to play a dominant role in modern consumer electronics. The devices become smaller, thinner and more powerful while semiconductors become the source of higher flux heat density. In order to reduce thermal resistance between a semiconductor junction and a heat spreader, semiconductor structures remain unpackaged i.e. flip-chip...
Materials based on sintered silver nanoparticles seems to be an effective thermal interface materials for microelectronic packaging, especially in power electronics where the thermal management is a key problem of reliability. The main advantages of such materials is high thermal conductivity of silver, ease of application in integrated circuit production and relatively low temperature of sintering...
The work in this article was aimed at the assessment of heat transfer through the system consists of stacked copper substrate, thermal interface material (TIM) and silicon die. Two types of TIMs studied within this paper were based on nano- and micro-sized particles of silver in various content rate of particles. The connection between chip and substrate made by TIM was achieved in sintering process...
Thermal Interface Materials are used in microelectronic packaging for reducing so called thermal resistance between heat source and heat sink. They are commonly used, often in form of thermally conductive adhesives, as an attaching materials for fixing silicon chips in the integrated circuits. Therefore, beside the thermal properties, a good mechanical strength of TIMs is required. Within this paper...
Continuous miniaturization of semiconductor devices enables integration in packages on increasingly smaller surfaces. Increasing power and minimization of dimensions results in diametrical increase of thermal flux density. Current works are focused on high performance TIMs (Thermal Interface materials). The main role of such TIMs is efficient dissipation of heat from electronic device to the surface...
In this paper preliminary investigations of electrical properties of new Thermal Interface Materials (TIMs') are presented and discussed. Investigated TIMs are based on mixture of silver flakes and silver nano-particles (nano-Ag) with high content of silver (more than 90% weight). After curing and sintering of such materials, as a result, a bulk, homogenous silver layer with good electrical and mechanical...
The ink-jet printing is a noncontact technique for production electrically conductive structures, also on flexible substrates. The greatest challenge is the conductive material for printing — the ink, because it influences the parameters of printed structures. The structures are nonconductive just after the printing and to obtain good electrical conductivity, they need an additional energy, mainly...
In this paper the influence of photonic sintering process parameters on the resistance of ink-jet printed structures were examined. The sintering process was performed by delivering to samples an energy in the form of light pulses (1200 J per pulse). There was specified the factors which would have the most significant influence on the results (resistance of sintered structure) such as: distance between...
Conductive inks market for printable electronic grows rapidly last years. The main disadvantage of using inks filled with nano-Ag particles is sintering process, which often requires relatively high temperatures (over 180°C). This forces the use of expensive, high temperature substrates, for example polyimide foils. In some applications it is unacceptable to subject substrate to high temperature,...
Miniaturization trend in modern electronics needs high density interconnect technologies and new materials, like elastic foils as substrates. Packaging on both external or even internal layers of such substrates needs electrically connections between layers. It is usually done by holes filled by electrically conductive materials and named as microvias. In the paper the ink-jet printing technology...
Combining conductive micro and nanofillers is a new way to improve electrical, thermal and mechanical properties of polymer composites for electronic packaging. Micrometric silver flakes and nanometric carbon nanotubes (CNT) exhibit high electrical and thermal conductivity. Moreover CNT improve strength, stiffness and fracture toughness of the polymer matrix. A new type of hybrid conductive adhesive...
In the recent years the huge demand for miniaturized, highly functional and also more and more reliable electronic equipment is observed. The development of electronic industry strongly depends not only on the scale of electronic components miniaturization but also depends on miniaturization and kind of printed circuit boards (PCBs). Nowadays, the flexible substrates plays more and more important...
Flexible electronics, which actual cover a significant part of electronic market, requires as low processing temperature as possible. Plastic foil type of substrates needs specific conditions for using it as a base of electronic circuits. For the practical production of printed electronics, one of important requirements is design the special type of inks with good printability and stability during...
Since the late eighties of the last century, digital ink-jet technology has been widely explored by the electronic industry in developing new manufacturing processes. Nowadays, ink-jet printing technology is increasingly being used to create the electrically conductive structures on flexible substrates. Ink for printing conductive microstructures is typically based on noble metals of nano-sized dimensions...
Very quick development of the new techniques for making printed circuits (R2R, Ink Jet) makes possible for using as a base substrate - flexible plastic foils. This solution are giving very strong requirements for printing process what is connected with substrate foils parameters. One of the most important problem is as low as possible processing temperature for obtaining electrical conductivity for...
The influence of nano silver filler content on properties of ink-jet printed structures for microelectronics were investigated. Samples were prepared by using ink with different nano silver filler content: 44 %, 41 % and 38 %. The electrical measurements were performed during and after heating process. It was shown, that filler content does not have a strong influence on sintering time, but it changes...
The using of conductive paste for the through holes and the blind holes filling in PCBs were analyzed. Such processes seem to be easy and can be applied instead of common used electrochemical plating process. The performed investigations have shown that these processes are not so simple.To understand more problems connected with microvias filling, the influence of adhesive rheology and printing parameters...
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