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The Electronic Conductive Adhesive (ECA) is a promising material as a substitute of traditional tin-lead solder, with many advantages outperforming tin-lead containing solder such as environmentally friendly, requiring much lower processing temperature and a much finer pitch. However, one critical problem related to ECA application is that the contact resistance increases significantly during an aging...
The continuous progress in miniaturization and integration of semiconductor devices have led to increasing heat generated from unit volume in the chip. Consequently, more efficient thermal management on chip and package level is required because the reliability of electronic equipment strongly decreasing with rising the temperature of work. To improve the heat dissipation from chip to package as well...
With the rapid development of technologies for high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute for solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, studies into the reliability of ICA are not as abundant as those...
Temperature cycling of electronic components was carried out at two different temperature profiles, the first ranging between -55degC and 100degC (TC1) and the second between 0degC and 100degC (TC2). Totally, 7000 cycles were run at TC1 and 14500cycles at TC2. The test board's top-side components were surface mounted using Sn-3.8Ag-0.7Cu solder alloy, and the bottom side surface mount devices (SMD)...
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