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Electrically conductive adhesive is a new type of environmentally interconnect material which can be used in electronic packaging to replace the traditional solders due to its advantages of simple applying process and low curing temperature. Silver coated graphene is employed in this work to enhance the thermal conductivity of the current commercial electrically conductive adhesive with very low thermal...
Nanoscale silver paste has a good application prospect in heat dissipation of high-power chips due to the characteristics of low temperature sintering and high temperature service. The properties of the nanosilver paste including thermal conductivity, electrical conductivity, and shear strength are affected greatly by the sintering process. The influence of different sintering methods on the performance...
Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high...
Graphene protection barrier was introduced to the interface between the ECAs and Cu-plated wire to enhance the reliability of the ECAs joints on Cu-Plated PCB substrate due to its excellent properties of impermeability to all gases/salts as well as its thermal/chemical stability. The results of shear test indicated graphene protection barrier can improve the shear strength of the ECAs joints on Cu-plated...
Thermal interface material (TIM) is applied to fill the air gaps of interfaces, which provides a path for interfacial heat transfer. Owing to the exceptional thermal properties of carbon nanotubes (CNT), TIMs based on CNTs have received much attention in recent years. In this study, heat dissipation performance of vertically aligned carbon nanotubes (VACNT) arrays as TIM in electronic packing was...
The need for faster and smaller, as well as more reliable and efficient consumer electronic products has resulted in microelectronic components that produce progressively more heat. The resultant reliability issues from the increased heat flux are serious and hinder technological development. One solution for microelectronics cooling applications is 2D materials applied as heat spreaders and these...
The Electronic Conductive Adhesive (ECA) is a promising material as a substitute of traditional tin-lead solder, with many advantages outperforming tin-lead containing solder such as environmentally friendly, requiring much lower processing temperature and a much finer pitch. However, one critical problem related to ECA application is that the contact resistance increases significantly during an aging...
In similarity to graphene, two-dimensional (2D) hexagonal boron nitride (hBN) has some remarkable properties, such as mechanical robustness and high thermal conductivity. In addition, hBN has superb chemical stability and it is electrically insulating. 2D hBN has been considered a promising material for many applications in electronics, including 2D hBN based substrates, gate dielectrics for graphene...
ZnO nanofibers were prepared by sol-gel processing and electrospinning technique. Poly (vinyl acetate) (PVA) and zinc acetate were used as precursors of PVA/ zinc acetate composite fibers. The composite and calcined nanofibers were characterized by Thermo gravimetric analysis (TGA), energy disperse spectroscopy (EDS), X-ray diractometer (XRD) and scanning electron microscopy (SEM), respectively. After...
Continued miniaturization in combination with increased performance in microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability in systems and devices. Thermal interface materials play a key role in the development of solutions for thermal management in microelectronics. In this paper, mechanical properties of a nanotechnology enhanced...
As the development of micro-systems moves towards higher speed and miniaturization, the requirement for interconnection density increases significantly. However, the use of conventional solders will be limited as the increasing I/O density lowers the pitches to very small size. Recently, there have been great developments in nano-composite solders. This paper investigated the influence of nano-titanium...
Heat dissipation has become a ‘bottleneck’ for the properties of electronics products and photoelectronic devices. Thermal interface material (TIM) plays a key role in heat dissipation, and must have flexibility and high thermal conductivity in order to decrease the thermal resistance of the interface between the device and heat sink or cooler. We developed a new type of nano-TIM based electrospun...
The composition and thickness of surface oxide of solder particles has a direct effect on adhesion and electrical resistance of soldering joint and resultant the quality of interconnect and the reliability of packaged system. Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) were used...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface...
Isotropic conductive adhesives (ICAs) are a type of interconnect material used more and more widely in computer, robot, mobile phone, LED and so on. Compared with traditional solders, isotropic conductive adhesives have better working plasticity, creep resistance and heat resistance. In particular, isotropic conductive adhesives are more responsive in high density packaging than solder, which determines...
Isotropic conductive adhesives (ICAs) with lower bonding temperature, higher resolution and environmental friendly have been used extensively in packaging process. In order to improve the electrical and thermal conductive properties of ICAs, two kinds of bimodal high temperature stable ICAs with matrix SHT6 and fillers with composition of macro silver flakes and boron nitride nanoparticles or macro...
The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes...
Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated...
Electrospinning is a historical technology which has existed for over seventy years. Recently, it has been introduced to make a novel electrospun nanofiber based thermal interface material (nano-TIM). Until now, there are few articles on the dielectric properties of nanofiber. Since the electrical insulation property is an important parameter for thermal interface materials, we investigated the dielectric...
Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface...
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