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Temperature cycling of electronic components was carried out at two different temperature profiles, the first ranging between -55degC and 100degC (TC1) and the second between 0degC and 100degC (TC2). Totally, 7000 cycles were run at TC1 and 14500cycles at TC2. The test board's top-side components were surface mounted using Sn-3.8Ag-0.7Cu solder alloy, and the bottom side surface mount devices (SMD)...