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The maximum temperature of all parts of automotive electronics equipment is given by the location and can vary between 358 K and 478 K. RoHS EU Directive in the context of the manufacturing costs reduction, necessity led automotive industry to create new Low-Temperature Lead-Free (LTLF) solder pastes family. In the paper, the thermophysical properties of the alloys from ALPHA® CVP-520 (SnBiAg) and...
Although only at the stage of proof of concept, a basic approach in Occam technology is: placement of components on a dielectric substrate, encapsulation, reversal of the substrate, drilling down to pins of components, creation of conductive traces, a.s.o. Since a reversed order of construction of a simple circuit is considered to be much cheaper in terms of required equipment, this paper presents...
The solder joints properties are determined by the specific morphology of their microstructure. In the paper are presented the comparative resistance measurements of the solder joints resulted by usage of lead/lead-free solder pastes from Vapor Phase Soldering Processes (VPS) having thermal profile with two different cooling rate, slow one (0.5 K/s) and rapid one (4 K/s). The results will be promote...
The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and low cost for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core as substrate. Taking into account only rigid PCBs, glass for applications requiring high levels of cleanliness (medical apparatus) or dedicated to work in high humidity...
The assembling of the electronic components on PCBs becomes a key issue in electronic packaging reliability. The solder joints resulting from the soldering process represent an important outcome for the PCB assembling. Moreover, the Lead-Free soldering requests, imposed by the RoHS Directive, can cause difficulties in obtaining a high quality/reliable soldering process. Considering the reliability...
The transition from through-hole technology to surface mount technology has increased the requirement for the reliability of the solder joint shear strength. The transition from lead to lead-free technology had issued new materials, but the most used alloy (SAC) offers an weaker shear strength to the solder joints than SnPb. The solder joints cannot fulfill the electrical and thermal functions if...
As known, thermal relief is a technique used to separate soldering pads or plated through-hole vias from large copper planes in order to reduce soldering dwell time by providing thermal resistance during the process, thus minimizing the heat transfer to the plane. However, during normal operation, the same thermal resistance limits the heat transfer for power component dissipation. The narrower the...
In the process of the human resources formation it is very important to acquire practical skills. This feature becomes critical when the subject has to teach other people at his turn. Among ??Train the trainers days?? event held in the frame of Elect2EAT projects were two hands-on workshops, design and assembling. The attendees were mainly teaching stuff, trainers involved in high-school and vocational...
The solder joints properties are in connection with their microstructure, which is the result of the soldering process temperature gradient action over the trinomial solder alloy/paste, electronic components terminals/pin and PCBs pads characteristics (4P soldering model). The temperature gradient was determinated by the specific thermal profile of the soldering process. As part of COST Action MP0602,...
As known, there are three parameters for controlling the thermal profile in vapour phase soldering machine; the paper refers to one of them - the electric energy from the AC mains introduced in the system in order to bring the thermal agent to the boiling point and to obtain the appropriate vapours density. The idea was to control the power dissipated in the heating element, one power resistor, by...
The purpose of this paper is to present the applied research work, performed in POLITEHNICA University of Bucharest, Center for Technological Electronics and Interconnection Techniques (UPB-CETTI) in the frame of one European project and two diploma projects, oriented to the development of a VPS (Vapour Phase Soldering) equipment using ecological, lead-free, electronics and tailored to small and medium...
The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and lowering costs for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core. Taking into account only rigid PCBs, there are currently used metals (Al, Cu, brass), for applications requiring excellent thermal management (RF modules, power...
The goal of an EMS company is to assure maximum assembling quality by minimum costs. This means minimizing losses on technological lines, minimizing defects and re-work time, optimizing assembling process in order to use minimum proceedings. The challenges are the lead-free technology with its increased temperature - could be up to 260degC when using infrared/convection techniques (IR/C) - and the...
In the last decade new materials were launched on the market. This is the case of PCB substrates, also. Requirements for improved heat transfer between power components and the solid metal base led to a new PCB technology, on copper and aluminum substrates. Typical applications are those where high level of heat has to be dissipated from the circuit (in LED applications, for example). Requirements...
Recording every aspect of the manufacturing process, from materials to production processes, whether at the board level or the entire system build, thus providing full product and process traceability, helps manufacturers to limit the scope of product recalls and reduces associated recall costs, while providing for compliance to a variety of environmental and safety regulations across all segments...
The paper presents the applied research performed in the frame of RESPLATEPE Romanian CEEX national project destined to implementation of ecological technologies in electronics industry, based on based on RoHS and WEEE directives [3]. The work represents a multi-criteria approach in electronics packaging and emphasizes the activity of eight research partners involved in various phases of electronic...
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