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The studies regarding magnetic field (MF) biotechnological applications in the range of Extremely Low Frequency (ELF: 3Hz to 300Hz, ITU Recommendation V.431-7) were generally based on Helmholtz coils (HC) systems in order to obtain a constant intensity for a determined volume. The paper presents the comparative studies of HC and Maxwell coils (MC) consisting in modelling, simulations and measurements...
The Electronic Innovation Cluster was founded in 2011 as a result of the already existing economic relations between Center of Technological Electronics and Interconnection Techniques from the Politehnica University of Bucharest and several SMEs from the Bucharest-Ilfov region of Romania. Following the cluster concept of triple helix introduced by Prof. Michael Porter, ELINCLUS has now 48 members,...
It is an actual trend for electronic equipment to be used into evaluation or influencing of health state or stress level of human been, of animals and of plants. As example, for the domains like space, the standard technology for survey and threat diseases is based on parameters of electrical body through biofeedback effects. The experiments were designed based on well-known work [1, 2] has as starting...
The solder joints properties are determined by the specific morphology of their microstructure. In the paper are presented the comparative resistance measurements of the solder joints resulted by usage of lead/lead-free solder pastes from Vapor Phase Soldering Processes (VPS) having thermal profile with two different cooling rate, slow one (0.5 K/s) and rapid one (4 K/s). The results will be promote...
This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up...
The following paper is a study on an electrical system which is using a Electrochemical Double-Layer Capacitor (EDLC) battery pack and an electronic system with minimal electromagnetic interference for use in automotive applications. The design of the electronic control module incorporated into the system, which represents an original solution for assuring minimal conducted and radiated electromagnetic...
Accumulators used in electric vehicles being in production to date have the disadvantage of a limited number of charge-discharge cycles (lead-acid accumulators) or high acquisition price (NiMH, Li-Ion) and long full recharge duration. This paper presents a study on a solution to increase the life cycle of a typical battery pack used in automotive applications by recovering the deceleration energy...
The present paper is the result of studies, experiments, modeling and simulation regarding electromagnetic compatibility (EMC) of an electronic module able to control and vary the power requirements of a Vapor Phase Soldering (VPS) machine in order to obtain the desired thermal profile. The original electronic solution has been designed to obtain very low radiated electromagnetic emission during operation...
The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and low cost for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core as substrate. Taking into account only rigid PCBs, glass for applications requiring high levels of cleanliness (medical apparatus) or dedicated to work in high humidity...
The assembling of the electronic components on PCBs becomes a key issue in electronic packaging reliability. The solder joints resulting from the soldering process represent an important outcome for the PCB assembling. Moreover, the Lead-Free soldering requests, imposed by the RoHS Directive, can cause difficulties in obtaining a high quality/reliable soldering process. Considering the reliability...
The Vapor Phase Soldering technology (VPS) requires accurate power control in order to obtain the optimum thermal profile for a reliable solder joint. In order to accomplish this, a programmable electronic module is used to obtain variable and controllable power injection during the Vapor Phase Soldering process (VPS) including the power-on and power-off phases. The module represents a proprietary...
The paper is the result of studies, experiments and simulations regarding electromagnetic compatibility (EMC) performance of an intelligent electronic module used to obtain variable and controllable power injection during the Vapor Phase Soldering process (VPS) including the power-on and power-off phases. The module represents an original solution for low conducted and especially low radiated emissions...
As known, there are three parameters for controlling the thermal profile in vapour phase soldering machine; the paper refers to one of them - the electric energy from the AC mains introduced in the system in order to bring the thermal agent to the boiling point and to obtain the appropriate vapours density. The idea was to control the power dissipated in the heating element, one power resistor, by...
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