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The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and low cost for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core as substrate. Taking into account only rigid PCBs, glass for applications requiring high levels of cleanliness (medical apparatus) or dedicated to work in high humidity...
The assembling of the electronic components on PCBs becomes a key issue in electronic packaging reliability. The solder joints resulting from the soldering process represent an important outcome for the PCB assembling. Moreover, the Lead-Free soldering requests, imposed by the RoHS Directive, can cause difficulties in obtaining a high quality/reliable soldering process. Considering the reliability...
As elements of interconnection structures at level two in electronic packaging, the pads could be considered as a particular solution into a virtual space defined by the materials, geometry, surface finishes and substrate. The assembling processes emphasize the substrate contribution over thermal mass and heat transfer. Each of the pad particular solution defined in the design stage will have unique...
As known, thermal relief is a technique used to separate soldering pads or plated through-hole vias from large copper planes in order to reduce soldering dwell time by providing thermal resistance during the process, thus minimizing the heat transfer to the plane. However, during normal operation, the same thermal resistance limits the heat transfer for power component dissipation. The narrower the...
The solder joints properties are in connection with their microstructure, which is the result of the soldering process temperature gradient action over the trinomial solder alloy/paste, electronic components terminals/pin and PCBs pads characteristics (4P soldering model). The temperature gradient was determinated by the specific thermal profile of the soldering process. As part of COST Action MP0602,...
In the current state, where the impacts of the pollution and the congestion of cities are increasingly acute, the public services like the car-sharing service can be an attractive complement for the other means of transportation. This type of service can reduce a part of traffic problems. To be efficient, the car-sharing service must ensure a high level of temporal and spatial availability. Car-sharing...
Chlorine dioxide (ClO 2 ) is a strong oxidizing agent that can be applied in solution as well as in the gaseous state. It has bactericidal, fungicidal and viricidal properties. Several food-related microorganisms, including Gram-negative and Gram-positive bacteria, yeasts, mould spores and Bacillus cereus spores were tested for their susceptibility to 0.08 mg/L gaseous ClO 2 during...
In case of prototyping and small series it can be identified a common practical issue for EMS (Electronic Manufacturing Services) companies, especially in case of prototyping and small series activities, regarding solder paste loss percent, production costs and solder joints reliability consequences. Although the solder pastes producers assure minimum 8 hours stencil life-STL (the warranted solder...
The reliability of microelectronics components and assemblies it should be considered as expression of solder joints functionality. The functions are in close connection with the microstructure of the solder joints, which are the result of the soldering Process temperature gradient action over the trinomial solder alloy/Paste, electronic components terminals/Pin and PCBs Pads finishes. Consequently...
In the last decade new materials were launched on the market. This is the case of PCB substrates, also. Requirements for improved heat transfer between power components and the solid metal base led to a new PCB technology, on copper and aluminum substrates. Typical applications are those where high level of heat has to be dissipated from the circuit (in LED applications, for example). Requirements...
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