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The need for low cost gas sensors has been required especially for home usage. Possible applications are, in buildings or basements where possible toxic gases can be accumulated, for example carbon monoxide, carbon dioxide, methane. This paper presents a first step in developing gas sensors based on impedance measurements. For optimal sensor operation a heater that should ensure uniform heating of...
The organic electronics products becomes every day more and more present, especially known being organic light emitting diodes (OLED), organic photovoltaic cells (OPV) or organic thin film transistors (OFET). It is very important to have a reliable solution for interconnection of these devices in a manner similar to printed circuit boards. This paper will present results on electrical and thermal...
A good way to characterize the quality of a solder joint is its thermal behavior at different currents and the current capabilities. The electrical current capabilities have been discussed in many other studies, but thermal investigations were not performed very often. The team developed a series of tests on boards with different configurations, and in all cases was proven that the solder joints heat...
In the process of the human resources formation it is very important to acquire practical skills. This feature becomes critical when the subject has to teach other people at his turn. Among ??Train the trainers days?? event held in the frame of Elect2EAT projects were two hands-on workshops, design and assembling. The attendees were mainly teaching stuff, trainers involved in high-school and vocational...
The purpose of this paper is to present the applied research work, performed in POLITEHNICA University of Bucharest, Center for Technological Electronics and Interconnection Techniques (UPB-CETTI) in the frame of one European project and two diploma projects, oriented to the development of a VPS (Vapour Phase Soldering) equipment using ecological, lead-free, electronics and tailored to small and medium...
The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and lowering costs for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core. Taking into account only rigid PCBs, there are currently used metals (Al, Cu, brass), for applications requiring excellent thermal management (RF modules, power...
The present stage of development of electronics technology there is an increased interest in the study of new materials used as solder that replaces the already banned tin-lead alloy. Many investigations were done in direction of metallurgic compatibility between the printed circuit board finishing, component terminal finishing and solder itself. Other studies are taken in direction of mechanical...
The goal of an EMS company is to assure maximum assembling quality by minimum costs. This means minimizing losses on technological lines, minimizing defects and re-work time, optimizing assembling process in order to use minimum proceedings. The challenges are the lead-free technology with its increased temperature - could be up to 260degC when using infrared/convection techniques (IR/C) - and the...
Recording every aspect of the manufacturing process, from materials to production processes, whether at the board level or the entire system build, thus providing full product and process traceability, helps manufacturers to limit the scope of product recalls and reduces associated recall costs, while providing for compliance to a variety of environmental and safety regulations across all segments...
The design of a compact microwave multilayer bandpass filter with aperture couplings and with an embedded-resonator topology is shown and investigated in this paper. Different types of inter-resonator and resonator-feedline couplings, in a three metallic-layer configuration, are presented. The bandpass filter is designed using coupling coefficients extracted through a full-wave electromagnetic-field...
The paper presents the applied research performed in the frame of RESPLATEPE Romanian CEEX national project destined to implementation of ecological technologies in electronics industry, based on based on RoHS and WEEE directives [3]. The work represents a multi-criteria approach in electronics packaging and emphasizes the activity of eight research partners involved in various phases of electronic...
The paper intents to present the applied research performed by a few Romanian technological teams for an optimum implementation of SAC alloys in electronics industry, based on RoHS Directive, in order to investigate the behavior of SAC solder alloys in electronic products. Because manufacturers will need to ensure that their products comply with the requirements of European Regulations by July 2006...
In design of high performance electronic assemblies, virtual thermal management and virtual thermal investigation based on specific CAD programs, which can offer optimum or close to optimum solutions, has become a paramount approach in order to obtain, from the first design and manufacturing flow, good working products. The question mark that appears sometimes is in direct link with the main problem...
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