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The maximum temperature of all parts of automotive electronics equipment is given by the location and can vary between 358 K and 478 K. RoHS EU Directive in the context of the manufacturing costs reduction, necessity led automotive industry to create new Low-Temperature Lead-Free (LTLF) solder pastes family. In the paper, the thermophysical properties of the alloys from ALPHA® CVP-520 (SnBiAg) and...
In the context of globalization, taking into account the assembling line in electronic industry movements to the central and east European countries, the continuous production costs reduction tendency and the difficulties to accomplish both financials respectively technical aspects of the business, untypical situations could be encountered with consequence over production quality and reliability....
The studies regarding magnetic field (MF) biotechnological applications in the range of Extremely Low Frequency (ELF: 3Hz to 300Hz, ITU Recommendation V.431-7) were generally based on Helmholtz coils (HC) systems in order to obtain a constant intensity for a determined volume. The paper presents the comparative studies of HC and Maxwell coils (MC) consisting in modelling, simulations and measurements...
Taking into account the real working temperatures from different zones and daily requirement of reduction of production costs, into automotive electronics production the trend is the one towards low melting point alloys that will enable energy savings and cost reductions during the manufacturing processes. In the paper, the mechanical strength of solder joints and samples having the same transversal...
The solder joints properties are determined by the specific morphology of their microstructure. In the paper are presented the comparative resistance measurements of the solder joints resulted by usage of lead/lead-free solder pastes from Vapor Phase Soldering Processes (VPS) having thermal profile with two different cooling rate, slow one (0.5 K/s) and rapid one (4 K/s). The results will be promote...
This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up...
The paper presents the research and development activities performed by authors for the conception and realization of a laboratory platform destined for temperature profiling at the level of the printed circuit board (PCB) during the soldering process inside reflow ovens [1], [3]. The platform was developed in the last months, being based on contact temperature measurement (with K thermocouples)....
Microstructural analysis in the section of solder joints show a multilayer structure composed of IMC layers caused by the interface phenomena specific to soldering processes and a typical volume, unaffected by these phenomena, but depending of soldering process thermal profile, especially by the cooling zone parameters. In the paper were theoretically studied and experimentally evidenced genesis of...
The aim of the research is to improve the exactness of the measurement of the surface tension of the molten SnAgCu soldering alloy at different temperatures. The method used for surface tension measurement of molten alloys is of pendant drop type. The weak point of this method is the exactness of the curvature radius measurement, but mostly the exactness of the first order derivative of the droplet...
The present paper is the result of studies, experiments, modeling and simulation regarding electromagnetic compatibility (EMC) of an electronic module able to control and vary the power requirements of a Vapor Phase Soldering (VPS) machine in order to obtain the desired thermal profile. The original electronic solution has been designed to obtain very low radiated electromagnetic emission during operation...
The increasing demand for high integration with continuous decreasing dimensions, maintaining quality and low cost for electronic modules brought on the market new types of printed circuits boards (PCBs), having different material core as substrate. Taking into account only rigid PCBs, glass for applications requiring high levels of cleanliness (medical apparatus) or dedicated to work in high humidity...
The assembling of the electronic components on PCBs becomes a key issue in electronic packaging reliability. The solder joints resulting from the soldering process represent an important outcome for the PCB assembling. Moreover, the Lead-Free soldering requests, imposed by the RoHS Directive, can cause difficulties in obtaining a high quality/reliable soldering process. Considering the reliability...
The transition from through-hole technology to surface mount technology has increased the requirement for the reliability of the solder joint shear strength. The transition from lead to lead-free technology had issued new materials, but the most used alloy (SAC) offers an weaker shear strength to the solder joints than SnPb. The solder joints cannot fulfill the electrical and thermal functions if...
As elements of interconnection structures at level two in electronic packaging, the pads could be considered as a particular solution into a virtual space defined by the materials, geometry, surface finishes and substrate. The assembling processes emphasize the substrate contribution over thermal mass and heat transfer. Each of the pad particular solution defined in the design stage will have unique...
The Vapor Phase Soldering technology (VPS) requires accurate power control in order to obtain the optimum thermal profile for a reliable solder joint. In order to accomplish this, a programmable electronic module is used to obtain variable and controllable power injection during the Vapor Phase Soldering process (VPS) including the power-on and power-off phases. The module represents a proprietary...
As known, thermal relief is a technique used to separate soldering pads or plated through-hole vias from large copper planes in order to reduce soldering dwell time by providing thermal resistance during the process, thus minimizing the heat transfer to the plane. However, during normal operation, the same thermal resistance limits the heat transfer for power component dissipation. The narrower the...
The paper is the result of thermovision experiments regarding the measurements of the temperature distribution on the surface of populated printed circuit board (PCB) in order to develop evaluation methods for solder joints quality as result of soldering process and for electronic modules “in circuit” functional tests. In the paper are presented and analyzed the methods emphasizing the differences...
The paper is the result of studies, experiments and simulations regarding electromagnetic compatibility (EMC) performance of an intelligent electronic module used to obtain variable and controllable power injection during the Vapor Phase Soldering process (VPS) including the power-on and power-off phases. The module represents an original solution for low conducted and especially low radiated emissions...
The quality and reliability of microelectronics components and assemblies can be considered as expression of solder joints functionality. The functionality of the lead free-solder joints is in strong connection with the microstructure, which is the result of the temperature gradient action over the trinomial solder alloy/paste, electronic components terminals and PCBs pads finishes, the gradient being...
The objective of this paper is to present the strategic project ??Promoting the entrepreneurial spirit within the Romanian electronics industry??, co-financed by European Social Fund (ESF). Its main objective is to promote entrepreneurship in Romanian electronics industry, the electronics packaging education, and technological transfer, to offer technological and technical support for innovative SMEs,...
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