Search results for: Fengze Hou
Microelectronics Reliability > 2017 > 79 > C > 38-47
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 10 > 1721 - 1728
Microelectronics Reliability > 2017 > 74 > C > 34-43
Microelectronics Reliability > 2016 > 65 > C > 98-107
Microsystem Technologies > 2017 > 23 > 10 > 4579-4589
Microsystem Technologies > 2014 > 20 > 12 > 2295-2300