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The development of a thinner core (:5100um) laminate array based exposed die fcCSP package with package to die area ratio > 12, package total height maximum 0.77mm that meets the JEDEC < ±100um warpage requirement is discussed. The same approach used for the 150um thick core exposed die fcCSP technology was used for this work, namely finite element modeling to guide the choice of mold compound...
Conference proceedings front matter may contain various advertisements, welcome messages, committee or program information, and other miscellaneous conference information. This may in some cases also include the cover art, table of contents, copyright statements, title-page or half title-pages, blank pages, venue maps or other general information relating to the conference that was part of the original...
Controlling wire sweep is critical in transfer molding process as excessive results in shorting of wires, which in tum cause electrical failure. Therefore, understanding the effects of various factors on wire sweep is crucial to ensure processability and high yield for Pd-Cu wire production. In this study, wire sweep characterization carried out on Low Quad Flat Package (LQFP) package subject to various...
DR-QFN / MR-QFN, is a conventional leadframe based QFN package in Dual-row / Multi-Row design, which provides QFN package configuration with higher IO up to ~100 counts. At present, TI (Texas Instrument) has been providing polyimide tape type substrate with Ball Grid Array package named as MicroStar Junior BGA™(u∗JrBGA™) for 100 more IO counts requisition. By applying the concept of Cu trace routing...
Thermosonic wire bonding is a well-known process which combines heat, ultrasonic energy and force to bond small wires to complete an electrical path from a metalized surface on a microchip to another metalized surface on the substrate of the circuit and the bonding occurs through the process of atomic diffusion. The bonding wire materials presently used in the industries are primarily gold (Au) and...
Intermetallic compounds (IMCs) formed between solder and substrate play a vital role in determining the long term reliability of microelectronic packages. Various attempts have been made by the researchers to control the morphology and thickness of IMC layers. The aim of this study is to investigate the effects of nanoparticle dopants into flux on the morphology and thickness of interfacial intermetallic...
When considering wafer level packaging (WLP) applications, the use of dielectric polymer materials becomes more relevant for reliability performance. Indeed, polymer materials can have excellent dielectric performances with a processability at lower thermal balance. Their mechanical properties also offer a better compliance between the silicon 3D stack and the organic substrate underneath, improving...
Plated Through Holes (PTH) in Printed Circuit Boards (PCB) are exposed to high thermal loads during the manufacturing process and in field application. This is due to a significant difference in the coefficients of thermal expansion between base material (epoxy resin) and copper barrel. For the assessment of the PTH reliability, the knowledge of the material properties of the electro-deposited copper...
In this study, die to printed circuit board (PCB) interfacial failure was investigated. Instead of using conventional Scanning Electron Microscope — Energy Dispersive X-ray Spectroscopy (SEM-EDX) and Fourier Transform Infrared Spectroscopy (FTIR) for bulk material analysis, advanced surface analysis techniques such as X-ray Photoelectron Spectroscopy (XPS) and Time-of-Flight Secondary Ion Mass Spectrometry...
A novel damage test method is presented, to examine the mechanical strength or behavior of an Integrated Circuit (IC) bond pad stack. A micro-mechanical tester is employed for an indentation test where quasi-static load is applied on the IC bond pad. Any damage or cracking can be detected by the acoustic emission (AE) sensor system placed underneath the IC chip. This methodology provides an in-depth...
The electrically conductive adhesives (ECAs) provide a large amount of opportunities for the electronic manufacturing. They have much lower processing temperatures, so the heat impact on the electronic components can be reduced. It makes them suitable for interconnecting the temperature sensitive elements in the devices, for example in liquid-crystal displays or modules of flexible thin film solar...
As handheld devices become increasingly smaller and complex, there is a shift in reliability requirements of solder pastes. Considering that thermal management and drop resistance of such devices become more challenging, improved thermal fatigue and mechanical shock properties grow into must have requirements. Additionally, multi-step assembly process and a surge in use of temperature sensitive components...
Silicon interposers are a technology with a history of multiple incarnations over more than 20 years. Today, interposers with TSVs are considered an alternative to 3D IC structures where die are stacked on top of each other using TSVs. Applications for interposers with TSVs include ASICs for networking applications and FPGAs. Xilinx's Virtex-7 2000T FPGA was one of the first new products using a silicon...
This paper explores the electrical performance of several multi-channel TSV designs i.e. cross-etched full-plated TSV and cross-etched partial-plated TSV to further improve data transmission bandwidth among the vertically stacked silicon devices. The electrical characteristics of the multi-channel TSV designs were investigated and compared against the conventional TSV design in terms of return loss,...
The purpose of this work was to demonstrate the compatibility of Dow Corning's temporary bonding solution with EVG's 850XT universal temporary bonding and debonding platform. The proposed process made use of well-known processing steps and processing modules like spin coating. The process consisted of a release layer (Dow Corning® WL-3001 Bonding Release) and an adhesive layer (Dow Corning® WL-4050...
The encapsulation of chips with fine pitch micro bump interconnections in chip-to-wafer (C2W) bonding has a known two steps process in wafer level packaging. First step is underfilling process that fills the gap between bumps underneath the chips. Under-filling process can either be using liquid dispensing which allow it to flow underneath the bumped chips by capillary force or using a non-flow under-fill...
In present work, micro-channel heat sink (MCHS) is integrated inside direct bond copper (DBC) for power electronics cooling. Based on commercial CFD code ANSYS Fluent, micro-channels are designed in back Cu-layer of DBC substrate with liquid water as coolant. Two advanced cooling structures, including double-layer (DL) and double-side (sandwich) micro-channel, are investigated. The sandwich structure...
As the embedded wafer-level packaging (eWLP) technology evolves to capitalize on package-on-package (POP) technology, thermal analysis has been performed to investigate and improve the heat dissipation capability of the 3D package structure. 3D simulation models have been built to study the impact of the thermal properties (underfill material, passivation layer and mold compound) and geometries (over...
The problem of heat removal is likely to become more severe due to the presence of hotspots in the integrated circuit chip. The heat dissipation capability of the upstream laminar micro-jet impinging array is investigated for hotspot cooling. Micro-jet impingement array cooling is an effective method of using liquids to cool electronics where high convective heat transfer rates are required. Several...
Electronics and microsystems technology are characterized by an ongoing miniaturization and a growing up of complexity of semiconductor components. These trends are described by Moore's Law and the terms “More Moore” and “More than Moore” (see Fig. 1). The most important driver of this development is the respective market of the final products — driven by the costs. In this context the development...
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