Search results for: Fengman Liu
Microwave and Optical Technology Letters > 60 > 5 > 1132 - 1136
Microelectronics Reliability > 2017 > 79 > C > 38-47
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 11 > 1882 - 1890
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 10 > 1721 - 1728
Microwave and Optical Technology Letters > 59 > 12 > 3181 - 3185
Microelectronics Reliability > 2016 > 65 > C > 98-107
Microsystem Technologies > 2017 > 23 > 10 > 4579-4589
Journal of Materials Science: Materials in Electronics > 2017 > 28 > 1 > 480-486
IEEE Transactions on Electromagnetic Compatibility > 2016 > 58 > 2 > 442 - 447