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The prospects of three newly developed platforms for broadband mid-infrared integrated silicon photonics (namely, silicon-on-nitride, the all-silicon optical platform and silicon-on-lithium niobate) enabled by the process of wafer fusion are investigated.
Silicon-based photonics has generated a strong interest in recent years, mainly for optical telecommunications and optical interconnects in microelectronic circuits. The main rationales of silicon photonics are the reduction of photonic system costs and the increase of the number of functionalities on the same integrated chip by combining photonics and electronics. In this paper, we will present recent...
Rare earth-doped organic materials represent a promising alternative to play the role of active materials for Photonic Integrated Circuits (PICs), meeting the requirement of low cost integration. In particular, Erbium Quinolinolates (ErQ) attracted a strong interest in the last decade for their good efficiency of emission in the C band of the optical communications centered at 1550 nm. In this paper,...
We demonstrate the simultaneous growth of multiple optically functional crystalline structures through a complex implantation and diffusion process. This includes ZnTe, ZnO and as-yet undefined silica crystallites doped with Er3+ or Tm3+ which are each characterized optically and structurally.
High capacity, guided, millimeter wave commun ication between integrated circuits is investigated with emphasis on a glass interposer integrated architecture. Silicon rectangular waveguides with integrated internal probes are designed both from the point of view of circuit theory and antenna theory in the presence of a sub cutoff wavelength backwall taper. Simulation results are compared with vector...
The nature of the ground optical transition in (In, Ga)As/GaP quantum dots is thoroughly investigated through k·p calculations and a supercell tight-binding simulation. Quantum dot morphology is deduced from scanning-tunneling-microscopy images. The strain field has a strong influence on the conduction band states. Indeed, for a pure GaAs QD, the wavefunction of the ground electron state is spatially...
We report the adhesion properties between glass plates and silicon chips by measuring compression shear strength changes of silane modified optical adhesives, Y-41, Y-42, Y-43, and Y-45R after various reliability tests, with the goal to apply these adhesives to the newly emerging Si-photonics area.
To realize an over 10-Tbit/s bandwidth optical interconnection, a 1000-channel light source was demonstrated by using novel spot-size converters with a SiOx slab layer for a wide fabrication margin and by optimization done in consideration of the thermal interference between each channel in an LD array and also between the LD array chips for low power consumption. We expect the multi-channel and high-density...
We developed an adhesive bonding process to integrate silicon nanomembranes onto silicon chips. A grating-coupled 1-to-32 H-tree optical distribution is experimentally demonstrated with an excess loss of 2.2 dB and a uniformity of 0.72 dB.
We demonstrate that record-high extinction-ratio of 50 dB is achievable in a 2×2 Si optical switch by making use of a variable splitter. The proposed switch will enable such high extinction-ratio even in volume production using standard CMOS fabrication facilities.
We demonstrate compact silicon microring resonators suspended in air with ultra-high optical quality, achieving an intrinsic quality factor of 9.2×105 in the telecom band for the resonator with a radius of 9 µm.
Recently Silicon Photonics has generated an outstanding interest for integrated optical communications. In this paper we describe a 300mm Silicon Photonics platform designed for 25Gb/s and above applications at the three typical communication wavelengths and compatible with 3D integration. Main process features and device results are described.
While optical spectral analysis has shown great promise in industrial and agricultural applications, the cost, size, and fragility of spectrometer instruments have hindered widespread application of the technology. MEMS microspec-trometers offer great hope for low-cost, light-weight, robust, spectrometers, paving the way for pervasive use of infrared spectroscopy in agriculture. In the past, germanium...
Hybrid integration technology of a laser source on a silicon optical waveguide platform by flip-chip bonding for silicon photonics has been developed. Several types of integrated laser sources were demonstrated, including multi-channel, high-density and high temperature operation.
This paper reviews the interconnect and package design of a heterogeneous stacked-silicon FPGA. Up to five dice from two die types are mounted on a passive silicon interposer. A hardware- and software-scalable FPGA family can be created by mixing different combinations of these two die types. The FPGA, inside a low-temperature co-fired ceramic (LTCC) package, consists of two silicon die types-up to...
We present the lowest energy per bit operation of a hybrid integrated light source on a silicon chip for optical interconnection considering wall-plug efficiency of a laser diode (LD). We investigated a multi-channel configuration for low power operation of light sources on a silicon substrate in a photonics-electronics convergence system. We confirmed that lower power consumption per channel can...
Silicon Photonics will become a mature technology at industrial level in one or two years. An overview including the status of the art of this technology is reported, and the main technological issues still to be focused on are discussed. Finally, ST view of the manufacturability status and of volume applications is provided as well as our vision of a Silicon Photonic roadmap.
We show that the dispersion of nonlinearity can be engineered in silicon slot waveguides over a wide wavelength range. A hardly observable nonlinear effect - reversed self-steepening now becomes possible on a chip.
An analytical model for calculating the nonlinear RF distortion products in silicon-based electro-optic Mach-Zehnder modulators is reported and experimentally validated. The model takes into account the nonlinearity inherent to the plasma dispersion effect.
As data rates and densities in networks have increased, Silicon Photonics has emerged as a primary enabler for upcoming high-speed interconnect applications. We discuss Luxtera's opto-electronic integration approaches that efficiently tackle these new requirements, including both monolithic and hybrid techniques
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