The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A novel bump structure was developed through the use of flexible incomplete-sintered Ag nanoparticles coated on top of Cu bumps by squeegee-coating. The proposed structure was bonded to Cu substrate successfully. The shear strength reached 118 MPa.
This paper analytically discusses the self turn-on phenomenon for SiC power MOSFET with deriving circuit formula and device characterization, and the effect of active Miller clamp circuit. The discussion is evaluated with the experiment.
TSV (Through Silicon Via) is regarded as the key enabling technology for 2.5D and 3D IC packaging solution. Si interposers with TSV have emerged as an excellent solution providing high wiring density interconnection, minimizing CTE mismatch to the Cu/low-k chip that is vulnerable to thermo-mechanical stresses, improving electrical performance and decreasing power consumption due to shorter interconnection...
We propose a novel touch panel structure, sensing method, and system which composes a low-cost transparent electrically-conductive thin film with higher Rs than the ITO film by two orders of magnitude. Relatively small number of extraction electrodes is directly attached upon the thin film without any circuit pattern. The proposed panel can realize even the wall tapestry-type touch panel of larger...
In this paper, a half-sized unbalanced dipole antenna with fan-shaped and trapezoidal elements on a printed circuit board is proposed. The VSWR and radiation patterns of the proposed antenna were investigated. As a result, VSWR characteristics less than 2.0 and a relative bandwidth of 110 % over the frequency band of 3.1 GHz to 10.8 GHz were obtained from measurements. Radiation patterns similar to...
We evaluated connectivity between a Vertical Cavity Surface Emitting Laser (VCSEL) and a multimode optical waveguide. It is important to evaluate Far Field Pattern (FFP) of VCSEL. FFP is different depending on the VCSEL maker. Tolerance curve of Graded Index-Multi Mode Fiber (GI-MMF) and GI-core polymer waveguide under shifted VCSEL from center differed. We estimate the difference is depending on...
We propose a method for measuring effects of surface roughness on transmission characteristics eliminating the manufacturing error. We verified the structure using electromagnetic simulation and measured three different types of surface roughness.
Along with the advancement in miniaturizing of mobile devices, typified by smart phones and tablet PCs, the semiconductor PKG substrate installed in these devices is demanded to be thinner and higher in density. As one of the most innovative solutions, the PoP (package on package) technology, which has the three-dimensional construction, has been expanding rapidly in recent years. However, the thinner...
In this paper, we demonstrate various electric current imaging using electromagnetic field reconstruction method, and show its capability of reducing stray magnetic field effect.
We found that positive-tone photosensitive polyimide (posi-PSPI) shows not to be compatible for electroless Ni/Au plating process which are used for Au micro bumping. In order to meet compatibility for the process, we improved chemical resistance of positive-tone photosensitive polyimide especially for electroless plating process. Changing of polyimide polymer structure is most effective to obtain...
This paper proposes a PDN design method using frequency-dependent target impedance considering frequency properties of jitter sensitivity of the IO buffer to power supply noise and switching current profile. We confirmed that this design and the resulting jitter of the I/O interface attributable to power supply noise meet the target value of less than 5 %UI.
Power supply noise spectra generated by CMOS digital circuits has been shifting to the higher frequency range, as the clock frequency of CMOS digital circuit is becoming faster year by year. Therefore, a new electromagnetic band gap (EBG) structure is strongly required to prevent the wide frequency noise from DC to high frequency components so as to apply to any operating frequencies of CMOS digital...
The kinetics which explained the copper Superfilling by electrodeposition was investigated since the copper electrodeposition became the standard technique for TSV. In order to interpret the bottom-up Superfilling process conveniently and exactly, a numerical model focused on the mass which can make the copper deposition in the via is built. This model only considered the effect of accelerator and...
Influence factors of warpage change during assembly process for 2.5D package using silicon-interposer were investigated. Mechanical properties of organic substrate have the dominant influence. In contrast, material properties of U.F. material have little impact.
The Cu specimens were fabricated by the UV-LIGA process using the electrodeposition bath for through-silicon-via (TSV) filling. Mechanical property of th e Cu specimens was investigated by a uniaxial tensile test. The elastic modulus, yield strength, breaking stre ngth and ultimate strain are 95GPa, 314MPa, 367MPa and 12.4%, respectively. The results indicated that the yield strength and breaking...
We developed a novel chip prober with a transparent membrane probe card for chip-level pre-bond testing of a three-dimensional integrated circuit. In the case of this chip prober, it was possible to achieve a uniform probing by using a parallelism-adjustment system with 3-point support. In addition, it was possible to achieve a small-gap alignment between the probe card and the tested chip by the...
The use of Cu balls and Cu-core balls is focused on 3D packaging technology to maintain a stable standoff height. However, these materials show unique soldering behaviors that are different from solder balls. In this paper, we examine how to utilize them.
Package-on-package (PoP) has been widely adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. Typical PoP solution is applied to logic processor as bottom package and memory device as top package. TMV® solution is being applied to reduce the warpage and achieve the fine pitch PoP and stable stacking performance. Currently, 0.4mm MIF(Memory Interface...
This paper presents a new millimeter-wave module concept, which is an integration of CMOS monolithic microwave integrated circuits (MMICs) and passive devices fabricated using a redistribution layer (RDL) technology. To realize a low-loss passive circuit, we introduced a multi-metal-layer for the RDL. The first metal layer was used as ground to shield from substrates. The upper metal layers form passive...
Power integrity design has become a critical issue in digital electronic systems, as advanced CMOS LSIs operate at higher clock frequency and at lower supply voltage. Power supply fluctuation excited by core circuits or I/O buffer circuits induces logic instability and electromagnetic radiation. Therefore, total impedance of power distribution network (PDN) must be taking into consideration in the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.