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We welcome you to the International Conference on Electronics Packaging (ICEP) 2014, the largest and premier international conference on electronics packaging in Japan, to be held from April 23rd to 25th at the Toyama International Conference Center in Toyama, Japan.
In this paper, an innovative heat management solution for the Light Emitting Diodes (LEDs) based on direct impingement cooling by Piezo fan has been proposed and evaluated. Round Piezo fans with 26 to 30 mm blade diameter, 1 to 5 mm fan thickness and narrow flow orifice (∼ 3 to 7.5 mm) were developed which could provide very high velocity air jet (> 10 m/s) for impinging heat source footprint directly...
Direct Water and Double-Sided Cooled Power Modules (DWDSCPM) are especially attractive due to high thermal performances. The DWDSCPM was able to reduce the thermal resistance by 50% and increase power density of the traction inverter by 70% in comparison with a conventional power module.
Solar and electric vehicles offer a sustainable future for the automotive industry and demonstration events offer realistic conditions to test and demonstrate the technology involved. We produced a four wheel solar car “Arrow1” by adopting a variety of appropriate technologies. These include the use of a lead-free solder alloy (Sn-Cu-Ni-Ge) in connections of the electric circuit boards of controllers,...
Recently, solar power generation using crystalline silicon wafers has been rapidly growing. It is well known that the mechanical properties of silicon wafers are affected by defects caused by slicing processes of the wafers. However the effect of the defects on the mechanical properties, especially, strength of the crystalline silicon wafers has not been clarified yet. In this paper, to clarify the...
To realize fine pitch pattering on printed circuit board, high productivity sputtering system for seed layer deposition is required. Roughened surface is necessary to get high adhesion by electroless plated seed layer, but seed layer formed by sputtering has high peel strength on smooth surface of dielectric material. And to achieve high productivity, high power source for sputtering has to be applied...
The limitation of the package height in the smartphone becomes severer and severer. Especially in the case of application processer, TSV structure is necessary to clear 1mm package height that is stacked by 2–4 DRAMs inside. But not only the cost of fabricating Through Si Via (TSV) on the Si device is expensive, also handling of the thin chip is fragile. To solve these problems, we have developed...
This paper describes the new wafer level packaging process with the diced chip array on the small-diameter handling wafer. The general purpose of wafer level packaging is to realize a smaller, more functional and cost effective electronic package. For example, Wafer Level chip size package and Wafer stacking 3D package are the most effective packaging processes/structures using semiconductor wafer...
In this research, a new structure and process integration for backside illuminated CMOS image sensor by using thin wafer handling technology is proposed. First of all, the wafer of a 3 Mega pixel CMOS image sensor is temporary bonded to a silicon carrier wafer with thermal plastic material and ZoneBond technology. Then the CMOS wafer is thinned down to few microns to detect the light from the backside...
We have developed the ultrathin 4-layer flexible printed circuits (FPCs) with the thickness of 135 um. This 135 um ultrathin 4-layer FPC is made by the molecular bonding technology, by which the electroless plating (metallizing) can be directly applied to polyimide (PI) by using molecular junction agents. In this study, we show the fabrication procedures, the mechanism of direct copper plating, and...
Advanced vertical interconnect technology that combines traditional HDI (high density interconnect) structures feature micro-vias and conductive paste-vias was developed to fabricate multilayer printed circuit board, such as ultra-multilayer printed circuit board like probe card or IC testing board, having excellent electrical performance, mechanical reliability and mass productivity at reasonable...
Organic interposer which utilize existing manufacturing infrastructure and material, has capability and potential to be in low cost. Furthermore, organic material property which has lower relative dielectric constant (Dk) than silicon dioxide (SiO2) potentially realizes higher bandwidth, keeping particular characteristic impedance on transmission line. In this paper, we focus on a simple chip-to-chip...
Recently, a high accuracy soldering method is required. Then, laser soldering has attracted attention. In laser soldering, it is difficult to detect an optimal laser condition depending on production conditions, because the amount of heat transfer from solder through copper wiring is different in circuit boards and soldering positions. Laser condition should be adjusted according to the situation...
Our study tries to apply a pulsating airflow to one of a heat transfer enhancement method in electronic equipment. In recent electronic equipment, a lot of electrical components are mounted while their performance increases and a level of heat dissipation becomes higher. The components cause flow separation of the cooling air and heat transfer performance rear the components generally decreases. Therefore...
This paper describes a cooling performance of a novel miniature piezoelectric micro blower. We especially focus on an investigation whether the piezoelectric micro blower is available for a novel cooling method of high-density packaging electronic equipment or not. In order to investigate the effectiveness of the piezoelectric micro blower, an understanding of the blower performance (P - Q curve)...
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