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A back-side grinding CMOS-MEMS process is well established for thinning wafers down to tens of micrometres for use in stacking chips. As a result of the mechanical process, the wafer backside is compressively stressed. In this paper, authors investigate the influence of the backside induced stress in MEMS/CMOS wafers thinned down to 35∼275 μm by means of a micro-Raman technique. We found that the...
Aluminum with Sn intermediate layer shows very large deformation even below 400°C. Using this new layer structure as sealing metal, high yield hermetic package of MEMS was demonstrated at only 370°C without any treatment of surface oxide removal. During bonding, the bonding metal is significantly pressed (the reduction rate of thickness ∼90%), which guarantees hermeticity at high yield. Based on SEM,...
In this paper, we proposed a slot antenna with three layers ultrathin silicon substrate based on MEMS bulk micromaching technology at 60GHz millimeter wave band. The substrate-integrated waveguide (SIW) is used as the feeding structure. The resonant cavity of the proposed antenna is filled with air instead of silicon, so the antenna achieves the low loss and broadband property. A slot structure is...
Micro Electro Mechanical Systems (MEMS) are systems based on a diversity of technologies whereby tiny mechanical elements with excellent system properties can be implemented. The substrate properties such as relative permittivity, relative permeability and electrical conductivity is varied and its effects on electric field distribution, displacement and potential is analyzed in MEMS EVA tunable filters...
This paper presents a MEMS-based capacitive pressure sensor with pre-stressed sensing diaphragms for achieving a linear response with applied pressure. The sensor is designed to work in touch-mode by using sensing pressure diaphragms with compressive residual stress on top of insulated counter electrodes. FEM (Finite Element Method) calculation shows that a sensing diaphragm with residual stress can...
For producing a variety of flexible MEMS sensors, we previously developed a process that uses a Cu On Polyimide (COP) substrate as a starting material and sacrificial Cu etching to produce a cavity and electrical feed-through structures on the substrate [1]. In the current study, we introduced a vacuum cavity realizing high thermal isolation in a flexible thermal sensor, for the first time. Parylene...
This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both die-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion...
Etching post-processes are usually done with systems based on MEMS structures compatible with CMOS technology like micro hotplates membranes used in MEMS gas sensors. Silicon anisotsropic etch steps follows fabrication of the integrated circuit in a silicon foundry for the release of the membrane but care should be taken to avoid damage to other layers used for integrated circuit fabrication, as aluminum...
A new technology for thin-film MEMS encapsulation with a monocrystalline silicon membrane is presented. The thickness of the membrane, used here, is 36 µm. It is produced on a dedicated wafer using a further development of the “Advanced Porous Silicon Membrane (APSM)” Process. The membrane wafer is attached to a MEMS wafer by glass-frit bonding. Before and during bonding the membrane is mechanically...
Vacuum encapsulated MEMS resonators are used in frequency references and gyroscopes. We present the use of porous silicon as a getter material for MEMS devices. Two types of devices were fabricated using the electrochemical etching and compared for quality factor. One type was with a cavity in the substrate of an SOI die, which helps in reducing the parasitic capacitance and the air damping. The other...
A silicon based THz substrate integrated waveguide (SIW) bandpass filter with a pair of antipodal linearly tapered slot Antennas (ALTSA) is designed and fabricated with MEMS process. A prototype with passband range 350GHz~370GHz is measured by using a quasi-optic measurement system. The measured data are in agreement with the simulated results, which show the filter has good selection performance...
We reports the experimental results of the novel polygonal microstructures self-assembled from the evaporating picoliter droplets in micro-scale cavities. Utilizing the inkjet-like method, the drop-on-demand (DOD) droplets of colloidal polymers (Polyurethane, PU 15% in volume) can be precisely positioned into the constrained regions on the polymeric (Polydimethysiloxane, PDMS) substrates which are...
We developed novel interconnection technology for heterogeneous integration of MEMS and LSI multi-chip module, in which MEMS and LSI chips would be horizontally integrated on substrate and vertically stacked each others. The cavity chip composed of deep Cu TSV-beam lead wires was developed for interconnecting MEMS chips with high step height of more than 100 um. Fundamental characteristics were successfully...
A new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 muW/cm2 for temperature difference of 6degC between two ends of thermocouple...
We report the development and application of a novel scanning probe array that consists of "blunt" and "sharp" tips with precisely defined contact areas. A new micromachining process based on SOI (silicon-on-insulator) substrates has been successfully developed to enable the fabrication of the scanning probe array. To demonstrate its capability for variable-resolution scanning...
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