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SnAgCu (SAC) solder is being offered as a lead-free termination finish. SAC finish is obtained by dipping the terminals of components into molten SAC solder. However, the reliability of solder joints formed with SAC solder refinished components needs to be determined in order to evaluate the effects of the SAC solder refinishing process. In this paper, the strength of solder joints with SAC solder...
In the automotive industry, electronic systems are expected to perform well under harsh reliability conditions. There is an emphasis to continuously develop ball grid array (BGA) IC packages that perform increasingly well with respect to board level temperature cycling reliability. This paper is a study of three No-Clean Polymer Flux (NCPF) materials and evaluation of their performance relative to...
Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package (PoP) with increasing demands is beneficial in cost and space saving. This study conducts the assembly of the PoP component through the stacking process. Samples are subject to thermal cycling test condition, 0°C to 100°C. The failure of samples is defined as when the measured resistance...
The copper barrel plating dissolution of printed wiring boards (PWB) occurring with multiple thermal stress testing had been studied in this paper. The thickness reduction of copper barrel plating and related copper dissolution rate were measured and compared for test specimens under the conditions of multiple thermal stress cycles (1X-6X) with two test temperatures (288°C / 260°C) in accordance with...
Condition monitoring is desired by power electronic system designers as a cost effective means of improving reliability. This paper presents a method to monitor solder fatigue inside a power module by identifying internal thermal resistance increases due to solder fatigue, taking account of the masking effects of a variable operating condition. It is assumed that the total power loss increases as...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25°C) and elevated temperature...
The article states first results of reliability measurement of committing of electronic modules with printed circuit board by lead-free solder balls (SAC 305). In order to obtain experimental data, the test boards are periodically exposed to thermal load from -20°C to +100°C with 20 minutes dwell time on the maximum and minimum temperatures. Test samples are produced on alumina ceramics and/or four-layer...
Electronics is already established as an integral part of modern vehicles. In order to enforce recycling and recovery of vehicles, the End-of-Life Vehicles legislation was developed in the EU. This directive includes bans for certain substances (especially lead). Compared to the lead-free soldering the assembly of electronic devices using electrically conductive adhesives (ECAs) has a number of technological...
Window ball grid array (wBGA) package has become one of the most popular alternatives for DRAM packaging due to its high I/O density, high heat dissipation, low profile and high electrical performance. The reliability issue with excessive warpage of the wBGA packages, which results in solder joint failure during or after solder reflow process, or during thermal cycling, is needed to be resolved. To...
The properties of lead free solder joints continue to change over a very long period of time in service before the microstructure becomes stable. The quantitative assessment of long term service life by accelerated testing invariably misses this significant effect, and may thus end up seriously misleading. The long term goal of the present work is to establish a protocol for preconditioning of lead...
In this paper, the material characteristics of six epoxies used for corner/edge-bonding are analyzed and compared to board-level mechanical reliability test. An innovative material characterization approach, button shear testing, provided an expedient method of determining adhesive strength between the epoxies and each relevant surface material. The board-level test included mechanical shock test...
Failure of organic packages is often accelerated by mechanical failure of an underfill designed to protect the solder joints. The crack growth rate of an underfill under thermal cycling is crucial for package reliability and lifetime prediction. Mechanically-induced fatigue crack growth results have been used in package reliability studies, but thermally-induced fatigue crack growth data for underfills...
The life time of the solder joint between base plate and ceramic substrate is usually tested by passively heating and cooling the power module (thermal cycling). This provokes delamination in the solder layer. But, the silicon dies in the power module are actively heated in the application. The accelerated life time test simulating this load is power cycling. The modules commonly fail at the end of...
Low-melting solder alloys are considered as one approach to lower assembly process temperature and therefore thermal stress on temperature sensitive component materials. In this study the reliability of 100 mum-solder bumps of low-melting Bi- and In-alloys has been investigated on a thin-film Al2O3 substrate (18 times 14 mm2) with more than 5000 I/Os. Two different bumping processes have been assessed:...
Optimisation of the reflow solder cycle is a critical task, in the sense that the consequences of poor process definition may affect the reliability of the assembly on the one side, as well as the industrial profitability on the other side. The present paper analysis the thermo-mechanical stress behavior of a typical electronic component under thermal profiles with heating and cooling rates varying...
Package-on-Package(PoP) technology is being used for high density designed and miniaturized electronic applications. In order to develop these small and complicated structured packages, it is important to predict accurately the structural behavior under various thermal conditions. For example, the package warpage control at solder melting temperature is required for the card or sub-package assembly...
Health management and reliability form a fundamental part of the design and development cycle of electronic products. In this paper compact real-time thermal models are used to predict temperatures of inaccessible locations within the power module. These models are then combined with physics of failure based reliability analysis to provide in-service predictions of crack propagation in solder layers...
This study is intended to investigate the effects of irregular conditions on the board level solder joint reliability during accelerated thermal cycling tests. In a previous research, the thermal fatigue lives of PBGA solder joints have been estimated using a 2-dimensional finite element model. The computational results agreed very well with the experimental data. In the present study, with the previously...
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