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Low-melting solder alloys are considered as one approach to lower assembly process temperature and therefore thermal stress on temperature sensitive component materials. In this study the reliability of 100 mum-solder bumps of low-melting Bi- and In-alloys has been investigated on a thin-film Al2O3 substrate (18 times 14 mm2) with more than 5000 I/Os. Two different bumping processes have been assessed:...
Low temperature co-fired ceramics (LTCC) is being widely used for microwave circuits. The BMBF funded R&D-project KERAMIS focuses on larger implementation of functionality in LTCC substrates to allow designs with "standard" MMICs. Target applications are circuits for multimedia satellite communications. In order to add more functionality in LTCC, current patterning limits of line width...
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