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Miniaturization trend in modern electronics needs high density interconnect technologies and new materials, like elastic foils as substrates. Packaging on both external or even internal layers of such substrates needs electrically connections between layers. It is usually done by holes filled by electrically conductive materials and named as microvias. In the paper the ink-jet printing technology...
Flexible electronics, which actual cover a significant part of electronic market, requires as low processing temperature as possible. Plastic foil type of substrates needs specific conditions for using it as a base of electronic circuits. For the practical production of printed electronics, one of important requirements is design the special type of inks with good printability and stability during...
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