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This paper demonstrates integration non-destructive analysis tools solution of MEMS multi-bonding to inspect the fusion bonding interface and eutectic bonding interface to locate defect layers. This analytical study shows successful SAT (Scanning Acoustic Tomography) and IROM (Infrared Optical microscopy) inspection of MEMS multi-bonding single issue layer. The multi-bonding double layers were happened...
This paper demonstrates a novel physical failure analysis (PFA) solution of MEMS motion sensor to inspect the fusion bonding interface between MEMS motion sensor proof-mass and oxide layer to locate defect points. This analytical study shows successful etching solution removal of MEMS motion sensor proof-mass and inspection of defect points.
Two new preparation methods of silicon substrates in the observation of micro-joint and micro-bumps failure mode were proposed in this study. One method is to use tilted grinding on 3DIC substrate to navigate the failed micro-joints. The other method can provide wider cross-section range by using ion polishing system studied in iST.
With the demands of higher multifunctional performance, 3D chips in stacking technology are widely developed recently. But the methods of 3D micro-bumps observation are normally confined to narrow widths. The polished width of either way of FIB or CP method is just able to reach the range of several to hundreds of micrometers. In this study, expanding to 3000 um of polished width is achievable by...
In this paper we present the thermal analysis and reliability performance of high power light-emitting diodes (LEDs) with silicon carrier packages. The junction temperature of LEDs is an essential reliability parameter. Exceeding the maximum raised junction temperature could lead to light output degradation and sometimes even to destructive failure. Therefore thermal management and proper thermal...
The wafer level hermetic packaging is a method of sealing micro-devices containing movable parts with a capping wafer in vacuum. The capping wafer is etched to form a cavity which will cover over the MEMS devices and the process is carried out at the wafer level before the device wafer is diced. Glass frit bonding is described as the most leak proof and robust sealing mechanism of all available methods...
Deep reactive ion etching (DRIE) process is one of the most popular fabrication techniques due to its flexibility between anisotropic and isotropic etching, and high etching selectivity. The alternating etching cycle flowing only etching gas of SF6 and then switching to sidewall passivation cycle using only C4F8 is used. However, the etching results depend on the process conditions such gas flow rate,...
The most important factor associated with cracking phenomenon during reflow soldering and molding are delamination at the interface of component material of packages. Copper has been widely used as substrate and leadframe as it has good thermal performance. However, Copper surface exposed to environment leading to weak interface bond with polymeric adhesive and encapsulant. Black oxide is a conversion...
A novel thermal-bubble-based micromachined accelerometer with advantages of low solid thermal conductance and high sensitivity is presented in this paper. With our proposed micro-link structure, a new accelerometer was built with a micro heater, two pairs of thermopiles which were floating over an etched cavity. The micro-heater is centered on the membrane and two pairs of thermopiles besides are...
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