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The Cu pillar is a thick under bump metallurgy (UBM) structure developed based on the consideration of alleviating current crowding in a flip-chip solder joint in operation conditions. We present in this work electromigration reliability and morphologies of Cu pillar flip-chip solder joints formed by joining Ti/Cu/Ni UBM with largely elongated Cu at ~62 mum onto Cu substrate pad metallization through...
This work presents electromigration reliability and patterns of Sn-3Ag-0.5Cu and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM), bonded on Au/Ni/Cu substrate pads. The solder joints were subjected to an average current density of 5 kA/cm2 under an ambient temperature of 150degC. Under the situation when electron charges flow from the UBM towards...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
Designed experiments are conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Electromigration patterns are investigated in solder bumps under a current stressing condition with an average current density of about 5 kA/cm2 at an ambient temperature...
We examine electromigration fatigue reliability and morphological patterns of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite solder bumps in a flip-chip package assembly. The test vehicle is subjected to test conditions of five combinations of applied electric currents and ambient temperatures, namely, 0.4 A/150 degC, 0.5 A/150 degC, 0.6 A/125 degC, 0.6 A/135 degC, and 0.6 A/150 degC. An electrothermal...
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