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The following topics were dealt with: microsystems integration; advanced packaging; assembly and manufacturing; material processing; and industrial equipment
Wafer bumping is growing in importance with the increasing used of flip chip package. In this study, we tried to determine which factors at photosensitive film lithography process had an effect on photosensitive film sidewall profile. The analysis of the experiment indicates that different exposure wavelength between G,H and I line wavelength or exposure energy and DOF (deep of focus) can affect the...
Rainbow phenomenon after lid sealing on package for optical device is a major defect in optical package assembly. UV adhesive effectiveness, AR glass and substrate selection are important to eliminate rainbow fringes. After design of experiment (DOE) studies, the optimizing process, best materials combination were found. The optical package passed moisture sensitivity level (MSL)3 at 260degC test
The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this...
During wet etching of micromachining, the cantilever beam is often attached to the underlying substrate due to the capillary force even the wafer being spin dry. The effect of rinse length and position of liquid on sticking phenomena is discussed is this work. Two critical gaps to determine the cantilever beam being sticking or not are derived. The results show the beam is a little more easily attached...
The PZT actuated porous membrane device with micro-scale nozzle array and generating the micro-scale liquid droplet with maximum flow rate of 20 ml/min is developed in this study. It could be used in the application of CPU cooling. It consists the advantages of simple and easily manufactured of the structure with PZT actuator. The pumping flow rate is independent of back-pressure and negative pressure...
This paper presents the design and analysis of high sensitive diaphragm for electret microphone applications. In general, the sensitivity of electret microphone depends on the electrical sensitivity and the mechanical sensitivity of the diaphragm. The high mechanical sensitivity can be determined by the mechanical properties of the diaphragm. In order to obtain high sensitive microphones, the properties...
The topics of 3D-IC packages are now widely studied around the world in recent years, not only in electronic packaging areas, but also in bioengineering areas and so on. With the developments of 3D-ICs technologies, packaging effects on 3D-ICs of Cu/low-k interconnects have become a critical reliability issue, especially in the assembly processes and reliability test procedures. In 3D-IC packages,...
Innovative technologies for the realization of packages and system-in-packages (SIP) with embedded components will be described. Embedding of semiconductor chips into substrates has several advantages. At first it allows a very high degree of miniaturization, since multiple layers of embedded components can be sequentially stacked. A further advantage is the beneficial electrical performance by short...
In this paper, we report a development of wafer-scale sealing test using different size micro-resonators. In order to characterize sealing quality, many research groups use vacuum sensors inside a cavity such as a comb-drive resonator or a diaphragm. Since the fabrication processes and structures are somewhat complicated, problems about the cost, yield and restriction of bonding materials can be arisen...
C4NP (C4-New Process) is a novel solder bumping technology developed by IBM and commercialized by Suss MicroTec. C4NP addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free solder alloys. C4NP is a solder transfer technology where molten solder is injected into pre-fabricated and reusable glass templates (molds). The filled...
The coefficient of thermal expansion (CTE) mismatch between silicon and organic printed circuit board (PCB) causes a reliability issue for the ball grid array type electronic package. This makes it difficult for the conventional wafer level chip scaled packaging (WLCSP) with large die to satisfy the reliability requirement. Therefore, in this study a novel solder joint protection-WLCSP (SJP-WLCSP)...
Packaging materials are important factors in cost, process, and performance of packaged devices. To minimize costs associated with redesign or rework, it is critical to select the right materials for a package at the design phase. Finite element analysis and other simulation tools have been widely used to optimize the target material properties and design parameters in microelectronic packaging. However,...
This paper describes the result of low temperature direct metal bonding of vertical-cavity surface-emitting laser (VCSEL) for flip-chip mounting to Si substrate by surface activated bonding (SAB) method. In the SAB process, radio frequency (RF) driven, low-pressure argon (Ar) plasma was used to clean the surfaces to be bonded. After organic contaminants on the surfaces of Au electrodes of the VCSEL...
A hybrid modeling technique has been developed for circuit-level simulation of advanced InGaAs, SiGe, and ZnSe-Ge HBTs in RFIC as well as OEIC systems. This intelligent approach distinguishes from prior ones in reinforcing the genetic algorithm (GA) with generalized analytical formulae (GAF) to efficiently extract physically-meaningful circuit elements used in the SPICE-like simulator. An in-depth...
As the semiconductor IC process technology enters the deep-submicron or nano level, the pad area and space in bonding is gradually demanded to be shrunk. As a result, the smaller pad area and space, the worse bondability with the recent bonding technology. How to solve this challenge issue is an urgent task in assembly industry. In this paper, we propose an adequate plasma treatment to feasibly overcome...
A new MEMS microphone package have been developed. A new technical process of LGA is utilized to meet the light, thin, short, small and high performance package. The developed leadframe based MEMS microphone can adopt SMD process, which can be applied to automatic cell phone microphone assembly process, and reduce 20% of the production cost
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