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Electrical, microstructural, and surface roughness of 150 nm sputtered pure samarium metal film on silicon substrates which thermal oxidized in oxygen ambient at various temperatures (600–900 °C) for 15 min have been investigated quantitatively. Effects of oxidation temperatures on the C-V characteristics, surface morphology, and surface roughness of Sm2O3 thin films were reported. The smooth and...
In this study, molybdenum (Mo) is incorporated into nickel (Ni) barrier films by electrodeposition using ammonia-citrate bath. Molybdenum contents in the range of 6–25wt% were investigated for their effectiveness in retarding the diffusion of copper atoms. The effect of the presence of Mo and multiple reflow on the interfacial reactions between Ni-Mo barrier film and Sn-3.8Ag-0.7Cu (SAC387) were investigated...
The trend towards the miniaturization and the replacement of lead-based solders in microelectronic devices raise concerns over reliability in the recent year. Particularly, the rapid growth of interfacial intermetallic compound layers can lead to brittle fracture in solder joints. In the present study, a novel nanoparticle doped fluxing method was used to prepare ball grid array solder joints in between...
Nanomechanical properties of intermetallic compounds (IMCs) formed in electrodeposited Cu/Sn and Cu/Ni/Sn multilayer interconnects were investigated in this study. The layers of Cu, Sn and Ni were formed by electrodeposition technique using copper pyrophosphate, tin methanesulfonic and nickel Watts bath, respectively. Deposition current density was set at 10 mA/cm2 for the copper bath and 20 mA/cm...
Characteristics of intermetallic compounds (IMCs) can have serious impacts on reliability of solder joint. In the current study, Ni nanoparticles (NPs) have been added to SAC305 solder / Cu substrate interface by flux mixing and their effects on electromigration (EM) under high current density have been investigated. Electromigration (EM) tests were operated under a current density of 1×104 A/cm2,...
Intermetallic compounds (IMCs) formed between solder and substrate play a vital role in determining the long term reliability of microelectronic packages. Various attempts have been made by the researchers to control the morphology and thickness of IMC layers. The aim of this study is to investigate the effects of nanoparticle dopants into flux on the morphology and thickness of interfacial intermetallic...
One of the fundamental requirements for high-temperature electronic packaging is reliable silicon attach with low and stable electrical resistance. This paper presents a study conducted on Cu nanoparticles as an alternative lead-free interconnect material for high-temperature applications. Cu nanoparticles were prepared using pulsed wire evaporation technique in water medium. Pure Cu nanoparticles...
Nowadays, nanoelectroctronic, electro-nanotechnologies environmental friendly products become the roadmap in industry. Hence, nanoscale of reinforcement into lead-free solder becomes more popular rather than the micro size of reinforcement. In this paper, Cobalt nanoparticles-reinforced Sn-Ag-Cu composite solders were prepared by thoroughly blending 0.75 wt% of cobalt nanoparticles with near eutectic...
Interfacial reactions during Si die attachment with Zn-Al-Mg-Ga high-temperature lead (Pb)-free solder on bare Cu lead-frame (Tamac 4) and Ni metallized Cu lead-frame were investigated using an optical microscope, scanning electron microscope (SEM) and energy dispersive x-ray (EDX). Die attachment was performed in an automatic die attach machine in a forming gas environment at temperature 380°C. The...
Summary form only given. This work investigates the reflow behavior of lead-free Sn-3.8Ag-0.7Cu solder on Cu substrate in the presence of Mo nanoparticles up to 0.1 wt%. Solders were reflowed in a reflow oven up to six times. The melting behavior of the composite solder was investigated by differential scanning calorimeter. The spreading rate and wetting angle were evaluated to measure the solderability...
Zn-Al based alloys have been suggested as high temperature lead-free solder for Si die attach by different researchers. But, so far, these alloys have not been tested in the industrial environment. In this study, Zn-Al-Ge alloy solder wire was used for Si die attachment on Cu substrate in an automatic die attach machine. The back side of the die was metalized with Ti/Ni/Ag layers. Die attachment was...
A study was conducted on BGA lead-free C5 solder joint system to compare SnAgNiCo versus conventional Sn3.8Ag0.7Cu solder alloy. This study showed that SnAgNiCo C5 solder system performed better than Sn3.8Ag0.7Cu in terms of joint strength and brittle mode failure. Shear and pull strength was measured by Dage which is representative of the intermetallic (IMC) strength between the C5 solder sphere...
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