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The trend towards the miniaturization and the replacement of lead-based solders in microelectronic devices raise concerns over reliability in the recent year. Particularly, the rapid growth of interfacial intermetallic compound layers can lead to brittle fracture in solder joints. In the present study, a novel nanoparticle doped fluxing method was used to prepare ball grid array solder joints in between...
Intermetallic compounds (IMCs) formed between solder and substrate play a vital role in determining the long term reliability of microelectronic packages. Various attempts have been made by the researchers to control the morphology and thickness of IMC layers. The aim of this study is to investigate the effects of nanoparticle dopants into flux on the morphology and thickness of interfacial intermetallic...