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Miniaturization and the need for the replacement of lead (Pb) based solders in microelectronic devices raise concerns over their reliability in the recent years. Particularly, the rapid growth of interfacial intermetallic compound (IMC) layers in Pb free solders can lead to brittle fracture. A novel nanoparticle doped fluxing method was used to prepare ball grid array solder joints between Sn-3.0Ag-0...
The trend towards the miniaturization and the replacement of lead-based solders in microelectronic devices raise concerns over reliability in the recent year. Particularly, the rapid growth of interfacial intermetallic compound layers can lead to brittle fracture in solder joints. In the present study, a novel nanoparticle doped fluxing method was used to prepare ball grid array solder joints in between...
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