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A test system was built to evaluate RF electromigration characteristics of solder interconnections. The test system measured DC resistance and RF insertion loss and testing was done with high frequency RF signals superimposed on 0 A, 0.25 A or 0.5 A of DC current at elevated temperatures. The test vehicle consisted of daisy chain test Si die with Sn0.7Cu flip chip bumps on 11 mum of plated Cu/Cu/TiW...
The redistributed chip packaging is an embedded chip technology that eliminates the need for wirebonds and flip chip bumps. This technology enables smaller packages at a lower cost, while providing improved mechanical, electrical and thermal performance. The process involves producing panels placing the chip active face down along with an embedded ground plane (EGP) and screen printing encapsulant...
The trend for microelectronic devices has historically been, and will continue to be, towards smaller feature size, faster speeds, more complexity, higher power and lower cost. The motivating force behind these advances has traditionally been microprocessors. With the tremendous growth of wireless telecommunication, RF applications are beginning to drive many areas of microelectronics traditionally...
In flip-chip interconnects under current stressing, the primary current crowding effect occurs at the entrance edge of the contact interface with the highest current density. In this study, an increased current density also occurred at the other edge of the contact interface, followed by a selective dissolution of under bump metallization. After primary current crowding, the rest of electrons flow...
The primary objective of this work was to characterize the current carrying capability of Sn0.7Cu solder bumps for use in high power flip chip module applications. The factors to be considered in using modules as test vehicles for current carrying capability studies are explored. Experimental data on the current carrying capability of Sn0.7Cu solder bumps in a module test vehicle is complemented with...
A series of electromigration tests were performed as a function of temperature and current density to investigate lifetime statistics for Pb-free solder with Cu or Ni under-bump-metallization (UBM). Based on the overall shape of resistance traces, a conservative failure criterion for time-to-failure was defined and the results were compared with those based on the conventional open-failure criterion...
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